Fundamental Study and Pragmatic Enhancement of Single Point Diamond Turning through Embedded Thin Film Sensor Arrays

金刚石工具的超精密加工越来越多地用于各种制造操作，其应用范围广泛，主要是光学背景，从半导体器件，医疗组件到激光技术。这项国际合作研究项目将为超精密操作引入新的温度和力测量技术。这些传感器将嵌入金刚石工具中，并通过薄膜技术生产;它们的尺寸仅为几微米，并位于切削刃区域附近。该传感器的响应时间在亚毫秒范围内，将为超精密切割的热化学和热机械过程提供新的见解。应用这些新的嵌入式传感器，IWF将重点研究三种不同金刚石材料的热化学磨损行为，并引入新的监测和控制方案，以避免基于微型嵌入式薄膜温度和力传感器测量的磨损。

Ultra-precision machining with diamond tools is increasingly being used for various manufacturing operations over a wide spectrum of applications with mainly optical background ranging from semiconductor devices, medical components to laser technology. This international collaborative research project will introduce new temperature and force measurement technology to ultra-precision operations. These sensors will be embedded into diamond tools and produced by thin film technologies; they will be only a few microns in size and located in the direct vicinity of the cutting edge zone. Providing response times in the sub-millisecond range, the sensors will allow new insights into the thermo-chemical and thermo-mechanical process of ultra-precision cutting. Applying these new embedded sensors, the IWF will focus on the investigation of the thermo-chemical wear behavior of three different diamond materials and the introduction of new monitoring and control schemes to avoid wear based on measurements with micro embedded thin film temperature and force sensors.