Development of ultrasonic hot press method for high-performance organic devices

在这项研究工作中，开发了一种新的超声波焊接印刷工艺。将有机半导体材料放置在两个带有晶体管电极的塑料薄膜之间，对样品施加超声振动。超声波焊接设备产生的瞬时和局部加热使半导体材料熔化。因此，在柔性薄膜之间制作了有机薄膜晶体管。与其他印刷工艺相比，本文提出的超声波焊接工艺是一种无溶剂工艺和绿色技术。该方法适用于耐热性较低的塑料基膜。

A novel printing process using ultrasonic welding technique has been developed in this research work. Organic semiconductor materials were placed between two plastic films with transistor electrodes, and ultrasonic vibration was applied on the sample. Instantaneous and local heating generated by the ultrasonic welding equipment make the semiconductor material melt. As a result, organic thin film transistors were fabricated between the flexible films. The proposed ultrasonic welding technique is solvent-free process and green technology compared with other printing processes. This method is applicable to low heat resistant plastic materials as a substrate film.