Development of non-aqueous electrochemical process for new functional materials

疏水和亲水微米级和纳米级粒子与非水电解质中的铝的电解共沉积。本研究证明了非水电解质共沉积微米级和纳米级粒子的可行性。不同疏水性颗粒的大程度共沉积也证实了通过使用非水电解质实现的水合力的消除，抑制了水电解质电解共沉积的主要局限性。这些限制是粒子的团聚和极难实现，共沉积疏水粒子如SiO_2， Al_2O_3, TiO_2，甚至微米尺寸的粒子。利用成本相对较低且易于操作的非水电解质制备纳米级颗粒的复合镀层，为开发具有独特功能特性的薄膜和涂层开辟了道路。从非水溶液中共沉积颗粒的可行性为复合镀层的应用开辟了新的领域。从水介质中电沉积活性金属，如Al， Mg和稀土，实际上是不可能的，因为它们的氧化还原电位很大。研制了一种新型氨酰亚胺盐——三甲基-正己胺双（（三氟甲基）磺酰）酰胺（TMHA-Tf_2N），并对镁和锌镁合金的电沉积进行了研究。在-2.8 V或更低的电位下获得了不能从水溶液中电沉积的金属Mg。虽然TMHA-Tf_2N为疏水性液体，但电解液中残余水对Mg及其合金的沉积有较大影响。

The electrolytic codeposition of hydrophobic and hydrophilic micron-and nano-sized particles with aluminium from a non-aqueous electrolyte is illustrated. This introductory investigation demonstrates that the feasibility of codeposition of micron-and nano-sized particles from non-aqueous electrolytes. The large degree of codeposition of particles of different hydrophobicity confirms also that the elimination of the hydration force achieved by using non-aqueous electrolytes, suppresses the major limitations experienced in electrolytic codeposition from aqueous electrolytes. These limitations are the agglomeration of particles and the extremely difficulty to achieve, codeposition of hydrophobic particles like SiO_2, Al_2O_3, TiO_2, even the micron-size ones. Composite plating with nano-sized particles from relatively low cost and easily operational non-aqueous electrolytes opens the way towards the development of thin films and coatings with unique functional properties. The feasibility of codepositing particles from non-aqueous solutions opens new fields of applications of composite plating.The electrodeposition of active metals, e.g. Al, Mg, and rare earths, from aqueous media is actually impossible due to their largely negative redox potentials. We developed a new ammonium-imide salt, trimethyl-n-hexylammonium bis ((trifluoromethyl)sulfonyl) amide (TMHA-Tf_2N) and investigated the electrodeposition of Mg and Zn-Mg alloy. Metalic Mg, which cannot be electrodepo sited from aqueous solution, was obtained at -2.8 V or ower potentials. Although the TMHA-Tf_2N liquid is hydrophobic, the deposition of Mg and its alloy was fairly affected by residual water in an electrolytic bath.