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Development of Binderless board

Development of Binderless board
无粘结剂板的开发
批准号:
15580142
负责人:
SATO Masatoshi
金额:
$2.05万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (C)
财政年份:
2003
资助国家:
日本
项目状态:
已结题
起止时间:
2003 至 2005

项目摘要

项目成果

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中文摘要
翻译
红麻无胶刨花板是对废弃生物质资源红麻芯材的有效利用之一。结果表明,在较高的热压温度下,无胶板材的耐水性能高于脲醛树脂或脲三聚氰胺甲醛树脂胶合板材。结果表明,在室外曝晒1年的条件下,无胶胶合板没有发生严重的劣化现象,木质素的热软化、游离羧酸形成的化学键以及木质素中缩合结构的增加是其自胶合机理的重要组成部分。在无胶板材的生产条件方面,由于热压压力和热压温度与木基材料相同,建议采用常规的板材生产条件和设备生产无胶板材,今后,无胶板材的生产应尽量采用常规的板材生产条件和设备。无粘结剂板将成为有效利用生物质废物一个重要目标,特别是在发展中国家,那里的人们没有或只有有限的木材资源,没有足够的化学工业,但农业剩余物过剩。
英文摘要
Kenaf binderless board has been developed as one of the effective utilization for Kenaf core part which is one of the abandon biomass resources. As the result, at high pressing temperature the water resistant properties of binderless boards were higher than for boards bonded with urea formaldehyde or urea melamine formaldehyde resins. And it was observed that there was no severe deterioration in the binderless board under the outdoor exposure test for one year.Moreover, thermal softening lignin, chemical bonds formed by free carboxylic acid, and increases in condensed structure in lignin were considered to be playing important role in the self-bonding mechanism. In contrast, furfural and cleavages of intermonomer linkages in lignin during the hot pressing process showed little contribution to the self-bonding.Concerning the manufacturing condition for binderless board, it is suggested that usual board manufacturing condition and device can be applied to produce the binderless board since pressing pressure and temperature is same as that of wood-based materials.In the future, binderless board will be become an important target for effective utilization of biomass waste, especially in developing countries where people have no or limited wood resources and no adequate chemical industries but a surplus of agricultural residues.
期刊论文(28)
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会议论文
Chemical change of kenaf core binderless boards during hot pressing <II> : effect on the binderless board properties
红麻芯无粘合剂纸板在热压过程中的化学变化<II>:对无粘合剂纸板性能的影响
DOI: --
发表时间: 2006
期刊: Journal of Wood Science Vol.52,No.3(先行オンライン版)
影响因子: --
作者: [Okuda N, Hori K, Sato M]
通讯作者: Sato M
DOI: 10.1007/s10086-005-0761-4
发表时间: 2006-06
期刊: Journal of Wood Science
影响因子: 2.9
作者: [N. Okuda;K. Hori;Masatoshi Sato]
通讯作者: N. Okuda;K. Hori;Masatoshi Sato
Water resistant properties of kenaf core binderless boards.
红麻芯无胶合板的防水性能。
DOI: --
发表时间:
期刊: Journal of Wood Science (in press)
影响因子: --
作者: [Okuda N, Sato M]
通讯作者: Sato M
Water resistant properties of kenaf core binderless boards
红麻芯无胶合板的防水性能
DOI: --
发表时间:
期刊: Journal of Wood Science (in press)
影响因子: --
作者: [Okuda N, Hori K, Sato M]
通讯作者: Sato M
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