Structural Analysis of Solid/Liquid Interfaces by Using UHV-EC STM Combining Systems

1995年，我们建造和改进了我们的固/液界面分析仪器。这些分析系统包括：1)比较原位电化学STM和非原位UHV-EC联用系统的测量结果；2)在紫外光下制备和定义单晶样品，进行原位电化学STM测量。1)电解质溶液中碘在铂(111)、金(111)和银(111)上的吸附结构分析。根据浸没电位的不同，碘在铂上形成(3x3)或(Roo&lt；7&gt；7&gt；)R19.1ﾟ结构。在Au(111)和Ag(111)表面上，根据溶液中施加的电极电位，碘表现出连续的结构变化。2)研究了Pd(111)、(100)和(110)电极表面的电化学刻蚀。结合系统可以理解原子尺度下的刻蚀过程。3)在超高真空下制备了Ni(100)和(111)表面，并将它们带入溶液中进行无污染的原位扫描隧道显微镜测量。在溶液中，镍表面呈现(100)和(111)两种结构。对刻蚀工艺也进行了研究。

In 1995, we constructed and improved our instruments for the analysis of solid/liquid interfaces. The analyical systems are for 1) easily comparing the results obtained by in-situ electrochemical STM and ex-situ UHV-EC combining system and for 2) in-situ electrochemical STM measurements on the single crystal samples prepared and defined under UHV.In 1996, by using these instruments, We carried out the following investigations. 1) Structural analysis of the adsorption structures of iodine on Pt(111), Au(111), and Ag(111) in electrolyte solutions. On Pt(111), iodine formes (3x3) or (ROO<7>xROO<7>)R19.1ﾟ structure according to the immersion potentials. On Au(111) and Ag(111), iodine exibites continuous structural change according to the applied electrode potentials in solutions. 2) Electrochemical etching of Pd(111), (100), and (110) electrode surfaces were examined. The etching process in an atomic scale was understood by the combining system. 3) Ni(100) and (111) surfaces were prepared under UHV,and they were subsequently brought into solutions for in-situ STM measurements without polution. Ni surfaces showed (100) and (111) structures in solutions. The etching processes were also examined.