Realization of High-Reliable Thin Film Capacitor by Anodizing A1- Transition Metal Intermetallic Compounds
Realization of High-Reliable Thin Film Capacitor by Anodizing A1- Transition Metal Intermetallic Compounds
批准号:
10650299
负责人:
SASAKI Katsutaka
金额:
$0.83万
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (C)
财政年份:
1998
资助国家:
日本
项目状态:
已结题
起止时间:
1998 至 2000
中文摘要
一般来说,许多化学计量金属间化合物在高温下表现出高硬度和高热稳定性。由阀门金属组成的化学计量比和低阻金属间化合物可以通过阳极氧化来实现高耐热和低损耗的薄膜电容器。此外,由于Hf、Hf、Ta氧化物的介电常数较大,如果将Al、Hf、Ta组成的金属间化合物进行阳极氧化,有望实现高介电常数电容器。为此,我们采用共溅射法制备了Al_3Hf、Al_3Zr和Al_3Ta金属间化合物薄膜,并对其电容器性能、漏电流和耐热性能进行了测试。结果表明:(1)这些阳极氧化电容器的耐热性能优于目前广泛使用的Ta阳极氧化电容器。(2)Al_3Ta电容器的介电常数最高。(3)Al_3Hf电容器的耐热性能最好,Al_3Zr的初始电容器性能最好。(4)三种阳极氧化电容器的漏电流极性差异不明显,因此,铝过渡金属间化合物阳极氧化制备的薄膜电容器是实现高可靠性薄膜电容器的最有前途的方法之一。
英文摘要
Generally, many stoichiometric intermetallic compounds exhibit high hardeness and high thermal stability at high temperatures. It is then expected that thin film capacitors with high heat-proof properties and low loss properties can be realized by anodizing stoichiometric and low-resistive intermetallic compounds composed of valve metals which are able to anodize. In addition, if intermetallic compounds which are composed of Al and Hf, Zr and Ta are anodized, we expect that high permitivity capacitor can be realized because the dielectric constans of Hf, Zr and Ta oxides are relatively large. Therefore, we prepared the intermetallic compound films of Al_3Hf, Al_3Zr and Al_3Ta by co-sputtering method, and examined the capacitor properties, leakage current and the heat-proof properties of these anodized capacitors. Following results were obtained.(1) The heat-proof properties of these anodized capacitors were superior to that of Ta anodized capacitor which has been widely used to date. (2) The dielectric constant of Al_3Ta capacitor among these capacitors was the highest. (3)The best heat-proof property could be obtained by using Al_3Hf capacitor, while the initial capacitor properties of Al_3Zr was the best. (4) The difference of the polarity on the leakage current was not recognized in these three anodized capacitors.Therefore, it is concluded that the thin film capacitors prepared by anodizing Al-transition metal intermetallic compounds are one of the most promising mothods to realize high reliable thin film capacitors.
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田邊,山根,佐々木 等: "Ta窒化物のTa-Al化合物への代替による薄膜キャパシタの容量低減の抑制効果"電子情報通信学会技術研究報告. CPM2000-71. 7-12 (2000)
Tanabe,Yamane,Sasaki等:“用Ta-Al化合物代替Ta氮化物对薄膜电容器电容减小的抑制作用” IEICE技术研究报告CPM2000-71(2000)。
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佐々木克孝、尾関雅彦: "バルブメタルの金属間化合物のアノード酸化とコンデンサへの応用" 表面技術. 50,1. 16-20 (1999)
Katsutaka Sasaki、Masahiko Ozeki:“阀金属金属间化合物的阳极氧化及其在电容器中的应用”Surface Technology 50,1。
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田邊,山根,佐々木 他: "Al_3Ta陽極酸化膜キャパシタの作製とその耐熱性"電子情報通信学会論文誌. J83-C. 972-974 (2000)
Tanabe,Yamane,Sasaki 等:“Al_3Ta 阳极氧化膜电容器的制备及其耐热性”,电子信息与通信工程师学会学报 J83-974 (2000)。
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H.Inada, M.Yamane, K.Sasaki, Y.Abe, M.Kawamura and H.Yanagisawa: "Anodization of Al_3Zr Intermetallic Compound Film and Its Application to the Preparation of Thin Film Capacitor with High Reliability"Trans.IEICE Japan. vol.J82-C-II, No.10. 543-550 (1999)
H.Inada、M.Yamane、K.Sasaki、Y.Abe、M.Kawamura 和 H.Yanagisawa:“Al_3Zr 金属间化合物薄膜的阳极氧化及其在高可靠性薄膜电容器制备中的应用”Trans.IEICE Japan。
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尾関,山根,佐々木 他: "Al_3Hf金属間化合物の陽極酸化膜による高耐熱,高信頼性薄膜キャパシタの実現"電子情報通信学会論文誌. J81-C-II. 619-627 (1998)
Ozeki、Yamane、Sasaki 等人:“使用 Al_3Hf 金属间化合物阳极氧化膜实现高耐热性和高可靠性薄膜电容器”,电子、信息和通信工程师学会汇刊 J81-C-II。 627 (1998)
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共 17 条
Preparation of Heat-proof Thin Film Capacitor by Using Ta_2N Anodized Film
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批准号:06555087
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项目类别:Grant-in-Aid for Developmental Scientific Research (B)
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资助金额:$3.84万
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财政年份:1994
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负责人:SASAKI Katsutaka
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依托单位:
海外基金