Study of improvement mechanism for highly polishing rate using maintained slurry under electrically controlled

本文介绍了一种利用交流电场对电子器件玻璃基板进行抛光的新技术。为了掌握抛光液在交流电场作用下的运动情况，我们利用自行研制的观测装置对抛光液的行为进行了观察，发现在交流电场的作用下，抛光液被平稳地引导到抛光区。此外，抛光区域的浆料分布效率提高了12%。在外加交流电场的情况下，抛光率比常规抛光提高了22%。

This paper deals with the development of a novel polishing technique for the glass substrate for electric devices by applying AC electric field. In order to grasp the movements of the slurry under AC electric field, we have observed slurry behaviors with an observation device we developed, and found that the slurry was smoothly led to the polishing area by AC electric field. Furthermore, effectiveness of the slurry distribution on the polishing area increased by 12%. Polishing rate also increased 22% compared to the conventional polishing when AC electric field was applied.