Development of chemical soft abrasive with high performance chemical mechanical polishing property

通常情况下，CeO_2是用作石英玻璃基板的磨料。人们希望减少铈（稀土）的使用。我们重点研究了聚合物基材料作为石英玻璃基板的抛光材料，以及各种类型的纤维素/无机材料混合球形微珠，以开发减少CeO_2使用的技术。此外，利用阳离子聚丙烯酸酯球形微珠开发了透明电极用化学软性磨料，以开发CeO_2的替代材料。在抛光性能方面，使用传统的硬质磨料对基片进行抛光，通常会对硅基片和玻璃基片表面产生波浪、划痕和边缘滚落。在透明电极的情况下，导电层从玻璃基板上剥离。而所研制的化学软性磨料不仅减少了玻璃基板抛光中二氧化铈的用量，而且对石英基板具有导电层无波动、无划伤、不剥落等优异的磨料性能。

Generally, CeO_2 is utilized as abrasive for quartz glass substrate in bulk. It was hoped that the use of cerium that is rare earth, was reduced. We focused polymer-base materials as polishing materials for quartz glass substrate, and various types of cellulose/inorganic materials hybrid spherical microbeads, in order to develop reducing technique of usage of CeO_2. In addition, we developed chemical soft abrasives for transparent electrode using cationic polyacrylate spherical microbeads, in order to develop alternative materials to CeO_2. In polishing property, the polishing of substrate using conventional hard abrasive often invoked the wave, scratch and edge roll-off against a silicon and glass substrate surface. In the case of transparent electrode, the conductive layer was peeled from glass substrate. However, the developed chemical soft abrasives not only reduced usage of ceria for polishing of glass substrate, but could provide the excellent abrasive performance to quartz substrate i. e, non-wave, non-scratch and non-peeling for conductive layer.