Study of elementary process of novel cleaning method by investigation of surrounding condensable vapor effect on single droplet drag reduction

在半导体器件制造的清洗工艺中，双液雾清洗技术得到了广泛的应用。在这项研究中，我们重点关注这种清洗技术的基本过程，即单个液滴撞击固体表面。我们通过实验观察了单个液滴对刚性固体表面的影响。重点研究了表面张力、表面粗糙度和周围压力的影响。周围气体压力的降低使液滴即使在低表面张力和粗糙表面的情况下也总是形成薄层。

In the cleaning processes of manufacturing semiconductor deVices, two-fluidspray cleaning technique is widely used. In this study, we fbcus our attention to the elementary process ofthis cleaning technique, i.e. a single droplet impact on a solid surface. We experimentally observe impact ofsingle droplet on a rigid solid surface. Especially we focus on the effects of surfaces tension, surfaceroughness and surrounding pressure. Decrease of the surrounding gas pressure makes droplets alwayscreate lamella even in the cases with low surface tension and rough surfaces