Damage-free etching of organic materials with mesoscopic cluster beams

利用介观团簇离子束，通过控制电荷状态、团簇尺寸和辐照过程中的环境气体，实现了有机材料的无损伤加工。本文采用与团簇离子束系统相连的原位XPS系统对有机材料进行损伤评价。已经阐明，需要低电离电压来抑制多电荷团簇离子的形成。此外，大团簇离子和辐照过程中环境气体的控制对于有机材料的低损伤加工是有效的。

Damage-free processing of organic materials with mesoscopic cluster ion beam was developed using pickup cell and by controlling charge state, cluster-size, and environment gas during irradiations. An in-situ XPS system connected to cluster ion beam system was used for damage evaluation of organic materials. It has been clarified that low-ionization voltage is required to suppress formation of multiply charged cluster ions. Besides, large cluster ions, and control of environment gas during irradiation is effective for low-damage processing of organic materials.