Improvement of strength and conductivity for Cu-Ti alloys aged in a hydrogen atmosphere
Improvement of strength and conductivity for Cu-Ti alloys aged in a hydrogen atmosphere
批准号:
23686104
负责人:
SEMBOSHI Satoshi
金额:
$6.74万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for Young Scientists (A)
财政年份:
2011
资助国家:
日本
项目状态:
已结题
起止时间:
2011-11-18 至 2014-03-31
中文摘要
我们尝试用加氢法制备高强度、高导电性的Cu-Ti基合金。Cu-Ti合金在氢气气氛中时效后,其电导率明显提高,但力学性能没有下降。强化主要是由于针状Cu4Ti析出相的细小分散,这与传统真空时效的情况相似。电导率的提高是由于基体相中溶质Ti浓度的降低,这是由Cu4Ti和TiH2的共析出引起的。在较高的氢压力下低温时效,改善了强度和导电性的平衡。时效前的预变形也有助于提高材料的性能。最终,我们证明了优化热机械工艺条件可以实现强度和导电性的良好平衡,分别超过950 MPa和25% IACS。
英文摘要
We attempted to prepare Cu-Ti based alloys with a high strength and a high electrical conductivity by hydrogenation procedures. The electrical conductivity of Cu-Ti alloys was significantly improved without degradation of the mechanical properties by aging in a hydrogen atmosphere. The strengthening was primarily due to fine dispersion of needle-shaped Cu4Ti precipitates, which was similar with the case of conventional aging in vacuum. The enhancement of the conductivity was due to a reduction of a concentration of solute Ti in the matrix phase, which was caused by co-precipitation of Cu4Ti and TiH2. The balance of the strength and conductivity was improved by aging under a higher hydrogen pressure at a low temperature. Prior-deformation before aging was also useful to improve the properties. Eventually, we demonstrated that optimizing the thermomechanical process conditions imparted an excellent balance of strength and conductivity, of more than 950 MPa and 25% IACS, respectively.
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DOI:
--
发表时间:
2011
期刊:
影响因子:
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作者:
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发表时间:
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DOI:
10.2320/matertrans.d-ma201031
发表时间:
2011-04
期刊:
Materials Transactions
影响因子:
1.2
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共 34 条
Principles for developing high-strengthened and high-conductive copper alloys via over-aging and severe deformation processing
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批准号:18H01743
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项目类别:Grant-in-Aid for Scientific Research (B)
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资助金额:$11.07万
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财政年份:2018
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负责人:SEMBOSHI Satoshi
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依托单位:
海外基金