Validation of novel method of tin oxide characterisation in electronic components as part of supply chain quality assurance

Adaptix开发用于医疗应用的新型3D X射线成像技术。样机也已经在无损检测(NDT)应用中进行了测试，以检查电子设备和部件，远远超过了当前2D X射线NDT系统的成像能力。它还具有更小的占地面积、更低的成本和更少的助熔剂(需要更少的屏蔽才能安全，因此便于桌面使用)。其目的是为行业现有的质量保证程序提供一种新颖的、具有商业吸引力的替代方案，该程序涉及用显微镜手动处理每个样本：行业需要自动化、廉价的质量保证方法，快速适用于整批样本。该项目将为我们现有的3D X光产品增加新的补充多模式成像能力奠定基础。具体地说，Adaptix的目标是将多波长光学成像整合到屏蔽的X射线机柜中。在X射线扫描的同时，我们将进行光学扫描，用于检测氧化。氧化锡对不同的光学波长具有不同的吸收，这是我们打算利用的特性。通过光学扫描，我们想要检测电子连接器上的氧化锡。当组分没有在适当的环境中保持时，就会形成这种氧化物。检测氧化锡还可能表明，假冒/翻新的零部件是否混入了所谓的新产品中，这在全球不受监管的供应链中经常出现，零部件被买卖多次。在每年8000亿美元的半导体销售额中，约320亿美元是通过“渠道”实现的。美国海军估计其15%的电子部件是假冒的，这可能是一个比大多数供应链更好的受控环境。该行业需要一种低成本的方法来提高测试吞吐量(可能达到100%)。重要的是降低总测试成本，并减少对昂贵而稀缺的训练有素的电子检查员的需求。这为我们用于无损检测应用的3D X射线系统增加了显著的价值。它将为第二版系统提供非常新颖和市场领先的功能，以推动进一步的收入和行业利益。NPL将帮助我们开发一种测试，以确定组件上是否存在氧化锡。他们还将帮助确定这种方法的敏感性和特异性，确定使信号检测和分辨率最大化所需的波长，并确定能够提供这一功能的商业来源。

Adaptix develops novel 3D X-ray imaging technology for medical applications. A prototype has also been tested in Non-Destructive Testing (NDT) applications to inspect electronics devices and components and far exceeded the imaging capability of current 2D x-ray NDT systems. It also has a smaller footprint, is lower cost and produces less flux (requires less shielding to be safe, so portable for desktop use). The aim is to deliver a novel and commercially attractive alternative to the industry's existing quality assurance procedures, which involve manual handling of each sample with a microscope: the industry needs automated, cheap quality assurance methods, applicable quickly, to an entire batch of samples.This project will lay the groundwork to add a new and complementary capability of multi-modal imaging to our existing 3D x-ray product. Specifically, Adaptix aims to incorporate multi-wavelength optical imaging within the shielded x-ray cabinet. Concurrent to the X-ray scan, we will conduct an optical scan that will be used to detect oxidation.Tin oxide has differential absorption of different optical wavelengths, a characteristic we aim to exploit. With an optical scan we want to detect tin oxide on electronic connectors. Such oxides form when the components have not been maintained in an appropriate environment. Detecting tin oxide may also indicate if counterfeit/refurbished parts have been mixed into supposedly new products, which is often the case in global and unregulated supply chains where parts are bought and sold many times. Of the annual $800bn in semiconductors sales,~ $32bn go through 'channel'. The US Navy estimates 15% of its electronic parts are counterfeit, and this is probably a better controlled environment than the majority of supply chains.The industry requires a low-cost method of increasing test throughput (potentially to 100%). It is important to reduce total test cost and the need for expensive and scarce trained electronics inspectors. This adds significant value to our 3D X-ray system for NDT applications. It would offer a highly novel and market-leading feature (in a new market) for the second version of the system to drive further revenues and industry-benefit.NPL will help us develop a test to identify the presence of tin oxide on the components. They will also help to establish the sensitivity and specificity of this approach, and establish the wavelength needed to maximise signal-detection and resolution, and identify commercially available source that are capable of delivering this.