Massively Parallel Assembly - A low cost high throughput manufacturing process for MEMS.

加速度计、陀螺仪和麦克风只是微机电系统（MEMS）的一些日常应用，而微机电系统现在在消费电子设备中无处不在。随着智能手机和平板电脑制造商努力进一步缩小他们的设备，因此这些设备中分离组件的浪费空间在物理尺寸和成本方面变得更加抑制。分离MEMS组件和主芯片的制造过程可以实现巨大的空间和成本节约，但前提是设计的过程随后结合两者是低成本和高通量的。NuNano正在开发一种能够同时处理400个MEMS组件的工艺，并将通过制造原子力显微镜（AFM）探针来证明这一点。这些探针由硅制成，由悬臂和尖端组成，很类似于唱机悬臂和触控笔，但其余的硅区域仅用于处理。通过分离探针的高精度功能部分和大块芯片材料的制造，将实现每片晶圆上更大的器件密度。

Accelerometers, gyroscopes and microphones are just some of the everyday applications ofmicroelectromechanical systems (MEMS) that are now ubiquitous components in consumerelectronic devices. As manufacturers of smart phones and tablets endeavour to shrink theirdevices ever further, so the wasted space separating components in these devices becomesever more inhibiting, both in terms of physical size and cost. Separating the manufacturingprocesses of the MEMS component and the host chip can enable massive space and costsavings to be realised, but only if the process designed to subsequently combine the two islow-cost and high-throughput. NuNano is developing a process of this nature which is capableof addressing 400 MEMS components simultaneously and will demonstrate this by manufacturing probes for atomic force microscopy (AFM).These probes, made from silicon, consist of a cantilever and tip, much akin to a record playercantilever and stylus, but the rest of the silicon area is only used for handling. By separatingthe fabrication of the high-precision functional part of the probe and the bulk chip material,a much greater density of devices per wafer will be realised.