Aerosol Deposition for Manufacturing and Developing Next Generation Dielectric Charge Storage Devices

可再生能源中的电力电子设备和恶劣环境电子设备需要在高电压和温度下提供可靠操作的鲁棒电介质电荷存储器件。宽带隙半导体、互连和高温封装已经发生了革命，允许在300 ℃的温度下工作。在电介质电荷储存技术方面也尚未取得类似的突破：克服这一障碍将推动电力调节和转换、能源储存、航空航天分布式控制系统、深井地热能和国防应用方面的电子技术。除了热弹性，新一代II类陶瓷电容器还必须在高电压下可靠安全地工作，这对于电力和储能应用尤为重要。该项目的主要目标是推进粒子气溶胶沉积（AD）作为基于新型碱土金属偏硼酸盐介电陶瓷的新一代电容器的产品开发和制造工具。我们将展示单室，多喷嘴顺序沉积电介质和电极材料，并通过复杂的工艺控制来制造包括陶瓷，金属和聚合物材料的多层结构。良性电容器的故障模式将进行调查，利用AD的室温制造和材料集成的独特功能。通过AD可获得的高陶瓷密度和10 nm级孔径，以及不存在热致陶瓷缺陷（因为我们选择了介电材料并避免了高温烧结），从而实现了现有材料和制造工艺无法达到的性能水平。该项目的关键组成部分是：使用级联反应器进行超细粉末快速成分原型的连续颗粒制造;用于细化颗粒结构的喷射研磨;支持AD工艺开发的计算流体动力学;新型介电材料AD参数的实验优化;电力电子转换器中新型电容器的评估。了解制造条件和产品性能之间的相互作用是这个多学科项目的一个重要组成部分。气溶胶沉积避免了一系列与高温处理相关的问题，这些问题会降低介电陶瓷的性能。这种未来的制造路线与单层、毫米级厚度和具有> 1 μ m组件层的多层电容器有关。在可扩展的制造工艺中，沉积速率超过10 μ m/min，为集成各种热相异材料的长期挑战提供了解决方案。该方法提供了令人兴奋的可能性，为工业制造环境中的approximation，带来优势的新兴领域的宽带隙半导体为基础的electronics.The项目将使用行业为重点的气溶胶沉积制造研究设施在曼彻斯特大学，其在英国的第一个，由亨利罗伊斯研究所资助。

Robust dielectric charge storage devices offering reliable operation at high voltage and temperature are required for power electronics in renewable energy and for harsh environment electronics. A revolution has already taken place in wide band gap semiconductors, interconnects and high-temperature packaging, allowing operation at temperatures of 300C. Similar breakthroughs have yet to be made in dielectric charge storage technology: overcoming this barrier would advance electronics for power conditioning and conversion, energy storage, aerospace distributed control systems, deep well geothermal energy and defence applications. As well as thermal resilience, the new generation of Class II ceramic capacitors must operate reliably and safely at high voltages, especially important for power and energy storage applications. The main goal of the project is to advance particle aerosol deposition (AD) as a product development and manufacturing tool for a new generation of capacitors based on novel alkaline earth meta-niobate dielectric ceramics. We will demonstrate single-chamber, multi-nozzle sequential deposition of dielectric and electrode materials, with sophisticated process control to fabricate multilayer structures comprising ceramic, metal and polymer materials. Benign capacitor failure modes will be investigated, exploiting the unique capabilities of AD for room-temperature fabrication and materials integration. The high ceramic densities and 10 nm scale pore sizes attainable by AD, together with an absence of thermally induced ceramic defects (because of our selection of dielectric material and avoidance of high temperature sintering) offers to realise performance levels unattainable from existing materials and manufacturing procedures. Key components of the project are: continuous particle manufacture using cascade reactors for rapid compositional prototyping of ultrafine powders; jet milling for refinement of particle structure; computational fluid dynamics to support AD process development; experimental optimisation of AD parameters for the new dielectric materials; evaluation of the new capacitors in a power electronic converter. Understanding the interplay between manufacturing conditions and product properties is an essential element of this multidisciplinary project. Aerosol deposition avoids a range of problems associated with high temperature processing that degrade dielectric ceramic performance. This future manufacturing route is relevant to single layer, mm scale thickness, and multilayer capacitors with > 1 um component layers. Deposition rates in excess of 10 um per min within a scalable manufacturing process offer a solution to the long-standing challenge of integrating a wide range of thermally dissimilar materials. The approach offers exciting possibilities for translatiion into an industrial manufacturing context, bringing advantages to the emergent field of wide band gap semiconductor based electronics.The project will use the industry-focussed aerosol deposition manufacturing research facility at Manchester University, the first of its kind in the UK, funded by the Henry Royce Institute.