Equipment for Quantum Science and Technology

先进的亚微米键合机是一种纳米制造工具，将为量子科学和技术的研究奠定基础。它将安装在SuperFab中，这是一家位于皇家霍洛韦的超导设备纳米制造设施。SuperFab代工厂提供制造用于传感、计量、安全和信息处理的超导量子设备的能力。皇家霍洛威发明的设备包括CQUID和HyQUID。SuperFab是未来英国量子处理器供应链的一部分。SuperFab于2019年4月开业，在世界级电子束光刻、氦离子显微镜和霓离子聚焦离子束工具方面投资约1000万GB，由先进的光学光刻、先进的沉积、蚀刻和表征工具支持，所有这些都致力于生产复杂的超导量子设备。Royal Holloway也是欧洲Microkelvin平台的一部分，这是一个欧洲先进基础设施，支持跨国访问伦敦低温实验室(作为欧洲八个设施之一)和SuperFab。该工具将在几个方面显著增强制造能力，并为量子材料和量子技术的广泛研究奠定基础。该焊接机将通过模块组件的精确对准和焊接，制造具有3D结构的超导设备。这些设备包括：寻求改善相干时间的量子处理器的原型超导设备；量子传感；量子超材料。这将使纳米流体设备的结合成为可能，以限制超流4He和超流3He。这将为超流体光力学的研究奠定基础，其中超流体4He的声学模式包括一个耦合到微波腔模式的高品质因数机械谐振器。它将为以下研究奠定基础：拓扑介观3He，这是早期宇宙中拓扑超导和相变的模型系统；拓扑自旋电子学；候选拓扑超导体；候选量子自旋液体。它将进一步支持用于暗物质搜索、微波光子学和传感器以及生物传感器的硅光倍增探测器的开发。除了学术研究的增强外，该焊接机还将使SuperFab能够满足面向市场的外部用户对生产线末端基础设施技术的苛刻期望，用于封装和连接使用最先进的电子束光刻制造的设备。

The advanced sub-micron bonder is a nanofabrication tool which will underpin research in Quantum Science and Technology. It will be installed in SuperFab, a superconducting device nanofabrication facility based at Royal Holloway. The SuperFab foundry provides capability to fabricate superconducting quantum devices for sensing, metrology, security and information processing. Devices invented at Royal Holloway include the CQUID and HyQUID. SuperFab is part of the supply chain for a future UK quantum processor. SuperFab opened in April 2019 following around £10M of investment in world-class electron beam lithography, He-ion microscopy and Ne-ion focussed ion beam tools, supported by advanced optical lithography, advanced deposition, etching and characterisation tools, all dedicated to the production of sophisticated superconducting quantum devices. Royal Holloway is also part of the European Microkelvin Platform, a European Advanced Infrastructure, supporting trans-national access to both the London Low Temperature Laboratory (as one of eight facilities across Europe) and SuperFab. The tool will significantly enhance fabrication capability in several ways, and underpin a broad range of research on quantum materials and quantum technology. The bonder will enable the fabrication of superconducting devices with 3D architectures, through the precise alignment and bonding of modular components. These include prototype superconducting devices for: quantum processors, seeking improvements in coherence times; quantum sensing; quantum metamaterials. It will enable the bonding of nanofluidic devices for the confinement of both superfluid 4He, and superfluid 3He. This will underpin research on superfluid opto-mechanics, in which the acoustic modes of superfluid 4He comprise a high quality factor mechanical resonator coupled to a microwave cavity mode. It will underpin research on: topological mesoscopic 3He, which is a model system for topological superconductivity and phase transitions in the early universe; topological spintronics; candidate topological superconductors; candidate quantum spin liquids. It will further underpin development of silicon photo-multiplier detectors for dark matter searches, microwave photonics and sensors, and biological sensors.Beyond the academic research enhancements the bonder will enable SuperFab to meet the demanding end-of-line infrastructure technology expectations of the market orientated external users, for packaging and connecting to devices fabricated using state-of-the-art electron beam lithography.