Integrated Functional Materials for System-in-Package Applications

集成电子技术继续在更广泛的频率范围内发展，以更大的电路密度。越来越多的研究和开发是针对补充单片硅电路的能力，额外的功能和结构材料，使用系统级封装（SiP）技术紧密集成。这种方法很好地发挥了英国的优势，英国在先进材料（如技术陶瓷和聚合物）以及替代微结构（如MEMS器件）方面的能力非常强大。该提案汇集了微制造和MEMS（帝国），先进薄膜材料（克兰菲尔德和利兹）和射频应用（利兹）领域的三个领先小组，创建了一个理想的联盟，以推进SiP领域。该项目将通过以下三个主题的工作，为这一行业趋势开发使能技术：将功能性陶瓷薄膜集成到电气和射频组件中，以增强性能或新功能；开发新型功能陶瓷薄膜，包括无铅电陶瓷，以减少对环境的影响；由于材料不匹配或加工不兼容，传统上被视为不兼容的材料组合的集成，以及在新的低成本基板上构建电路的技术。对于每个主题，工作将在单独的工作包中组织。将开发的组件包括可变电容器、传输线和滤波器；以及基于薄膜体声谐振器的传感器。材料的研究将集中在微波介质和铁氧体上。整合工作将包括几种将陶瓷薄膜从高温基板转移到聚合物基板的方法，以及这种基板的粘合技术。第四个工作包将针对一个整体系统演示器，以集成单独主题的结果。该项目将建立在目前由提案人进行的两个探索性项目的发展基础上：激光提升和键合工艺（利兹），以及MEMS 3D结构和器件中先进陶瓷薄膜的集成（克兰菲尔德和帝国）。

Integrated electronics technology continues to advance across an ever wider range of frequencies, at ever greater circuit densities. Increasingly research and development is being directed at supplementing the capabilities of monolithic silicon circuits with additional functional and structural materials, closely integrated using system-in-package (SiP) technology. This approach plays well to UK strengths, where the capability in advanced materials such as technical ceramics and polymers, and in alternative micro-structures such as MEMS devices, is very strong. This proposal brings together three leading groups in the areas of microfabrication and MEMS (Imperial), advanced thin film materials (Cranfield and Leeds), and radio frequency applications (Leeds), creating a consortium ideally placed to advance the SiP field. The project will develop enabling technologies for this industry trend through work on three themes:i. integration of functional ceramic films into electrical and RF components, for enhanced performance or new functionality;ii. development of novel functional ceramic films, including lead-free electro-ceramics for reduced environmental impact;iii. integration of material combinations traditionally seen as incompatible because of material mis-match or processing incompatibility, and technologies for building circuits on new low-cost substrates. For each theme, the work will be organised within a separate workpackage. Components which will be developed include variable capacitors, transmission lines and filters; and sensors based on thin-film bulk acoustic resonators. Research on materials will focus on microwave dielectrics and ferrites. The integration work will include several methods for the transfer of ceramic films from high temperature- to polymeric- substrates, and bonding techniques for such substrates. A fourth workpackage will target an overall systems demonstrator to integrate the results of the separate themes.The project will build on developments in the two Exploratory projects currently being undertaken by the proposers: on processes for Laser-Lift-Off and bonding (Leeds), and on integration of advanced ceramic films in MEMS 3D structures and devices (Cranfield and Imperial).