Advanced Ultra-wideband (UWB) devices for wireless communications and radar

超宽带（UWB）技术是最新的射频（RF）器件技术之一。新技术是非常有前途的未来无线通信和成像雷达应用，其中高容量多址和超高速传输高达几百Mbps的可以实现。UWB有可能为英国经济做出重大贡献。然而，随着无线通信和服务的扩展，可用的RF频谱越来越稀缺。如果要充分利用UWB的巨大潜力，必须解决与其他服务的干扰问题。滤波技术是控制射频信号频谱和解决干扰问题的关键。该方案旨在为未来的UWB无线通信和雷达系统开发先进的UWB滤波器，系统级封装（SOP）是一种非常有吸引力的方法，用于开发未来的UWB RF前端，其中可以实现高性能模块，同时实现成本和尺寸的减小。为此，拟议的研究将部署液晶聚合物（LCP），最近出现作为一种新的微波基板和封装材料。它在非常宽的频率范围内具有低损耗、接近密封的性质、多层能力，并且成本低，因此是SOP集成的理想选择。特别是，这种低成本的解决方案是至关重要的，如果UWB产品要在个人消费市场上取得成功。拟议的研究将探讨新的设计理念。创新的UWB滤波结构，利用LCP的多层能力，将实现在光使制造技术，如激光加工。可重构UWB滤波子系统集成在一个单一的LCP封装的有源和无源组件将被开发。

Ultra wideband (UWB) technology is one of the latest radio-frequency (RF) device technologies to hit the news. The new technology is very promising for future wireless communications and imaging radar applications where high-capacity multiple access and ultra high speed transmission up to several hundreds of Mbps can be implemented. UWB has the potential to make a substantial contribution to the UK economy. However, with the expansion of wireless communications and services, the available RF spectrum is growing scarce. The problem of interference with other services is one which must be solved if the great potential of UWB is to be fully exploited. Filtering technologies are key to controlling the spectrum of RF signals and tackling interference issues. This proposal aims at developing advanced UWB filters for future UWB wireless communications and radar systems.System-on-package (SOP) is a very attractive approach for the development of future UWB RF front-ends, where a high-performance module can be implemented while simultaneously achieving cost and size reduction. To this end, the proposed research will deploy liquid crystal polymer (LCP) that has recently emerged as a new microwave substrate and package material. It has a low loss over a very wide frequency range, near hermetic nature, multilayer capability, and is low cost, and so is ideal for SOP integration. In particular, such a low-cost solution is vital if UWB products are to succeed in the personal consumer market.With this new material a great deal of effort is required on the design and implementation. The proposed research will investigate new design philosophies. Innovative UWB filtering structures that exploit multilayer capability of LCP will be implemented in the light of enabling manufacturing technologies such as laser machining. The reconfigurable UWB filtering sub-system integrating both active and passive components in a single LCP package will be developed.