Development of energetic nanomaterials for microelectronics applications

50多年来，金线和铜线一直用于微电子工业，用于硅芯片上单个电子元件之间的信息传输。这些电线作为数据高速公路，通常直径小于人类头发的一半，在其两端焊接在基板上。由于密实的导线容易相互接触而引起电短路，因此在导线表面形成了一层绝缘层。然而，对于铜线来说，由于其硬度较大且在空气中容易氧化，因此需要一种新的工艺来提供多余的热量来熔化涂层以及连接线材和基板。该研究将探索高能纳米材料（纳米复合材料和核壳纳米颗粒）在便携式微电子先进线键合工艺开发中的应用。一旦被点燃，这些纳米材料，也被称为纳米铝热剂，可以在几毫秒内释放出大量的能量。这样产生的电力将有利于电线

For more than 50 years, the gold and copper wires have been used in microelectronics industry for information transfer between individual electronic components on silicon chips. These wires, acting as data highways and usually less than half the diameter of a human hair, are welded at each of its ends on the base board. Because the dense wires could touch one another and cause electrical short circuit, an insulation layer has been developed and coated on wires' surface. For copper wires, however, because their hardness is greater and they are easily oxidized in air, a novel process is needed to provide the excessive heat to melting the coating layer as well as to join the wire and the base board. The proposed research will explore the utilization of energetic nanomaterials (nanocomposite and core-shell nanoparticles) in the development of advanced wire bonding processes for portable microelectronics. Once ignited these nanomaterials, also called nano thermite, could release a great amount of energy in a few milliseconds. The power generated in this way will facilitate the wire