Sensitive synthetic dry adhesives for pick and place application in MEMS

我们正在提议将新型生物灵感粘合剂集成到机器人拾取和放置系统的末端执行器中，用于组装和封装MEMS和微流体。微制造芯片的最终封装是MEMS或微流控技术商业化最具挑战性的问题之一。每个芯片必须小心地放置在包含电气或微流体互连的包装中，密封并粘合在一起。传统上，拾取和贴装机器人使用主动吸力将芯片固定到位，同时将其移动到位，但这需要主动气动系统、复杂的末端执行器尖端，并且可能会损坏具有自由移动部件的设备，例如MEMS。普通粘合剂不能使用，因为它们不能切换，而且传统的粘性材料会在微机械的表面留下残留物。

We are proposing the integration of novel bio-inspired adhesives into the end-effectors of robotic pick and place systems for assembly and packaging of MEMS and microfluidics. One of the most challenging issues for commercialization of MEMS or microfluidics is the final packaging of the microfabricated die. Each individual die must be carefully placed in a package containing electrical or microfluidic interconnections, sealed and bonded. Traditionally, pick and place robots have used active suction to hold die in place while moving them into position, but this requires active pneumatics, a complex end effector tip and can potentially damage devices with freely moving parts, as in the case with MEMS. Normal adhesives cannot be used because they are not switchable, and traditional tacky materials will leave residues on the surfaces of MEMS