Creep modeling of precision adhesive joints in opto-electronic devices
Creep modeling of precision adhesive joints in opto-electronic devices
批准号:
463690-2014
负责人:
Spelt, Jan
金额:
$1.42万
依托单位:
依托单位国家:
加拿大
项目类别:
Collaborative Research and Development Grants
财政年份:
2014
资助国家:
加拿大
项目状态:
已结题
起止时间:
2014-01-01 至 2015-12-31
中文摘要
光电子器件由附着在基板上的光学元件组成;将这些部件固定到基板上的最常见方法是使用粘合剂。在内外部应力的影响下,粘合剂容易发生蠕变和应力松弛,这可能会导致光学元件位置的微小扰动,从而随着时间的推移影响性能。光学机械设计需要考虑精密胶粘剂的这种寿命终结(EOL)行为。缺乏针对这些机制进行设计的预测性模型,导致了经验法则设计标准和材料选择过程。
英文摘要
Opto-electronic devices consist of optical elements attached to a substrate; the most common method of fixing these components to the substrate is by means of adhesives. Adhesives are susceptible to creep and stress relaxation under the influence of internal and external stresses, which may lead to subtle perturbation of the position of optical components, thereby affecting performance over time. Opto-mechanical design needs to account for this end of life (EOL) behavior of precision adhesive bonds. There is a lack of predictive model for designing against these mechanisms, leading to rule-of-thumb design criteria and material selection processes.
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