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Mechanical fatigue of a lead-free solder alloy

Mechanical fatigue of a lead-free solder alloy
无铅焊料合金的机械疲劳
批准号:
474836-2014
负责人:
Weck, Arnaud
金额:
$1.82万
依托单位:
依托单位国家:
加拿大
项目类别:
Engage Grants Program
财政年份:
2014
资助国家:
加拿大
项目状态:
已结题
起止时间:
2014-01-01 至 2015-12-31

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中文摘要
翻译
在微电子封装中,焊点确保印刷电路板(PCB)和芯片之间的电气和机械连接。在使用过程中,局部工作温度反复升高和降低,使封装组件暴露于由涉及的材料(包括焊点)的不同热膨胀系数引起的热机械应变。焊料中的这些循环机械应变导致热机械疲劳裂纹的萌生和扩展,从而导致焊点失效。除了热机械疲劳外,当板或基板在机械处理过程中弯曲或受到振动力时,焊点也会受到机械疲劳的影响。
英文摘要
In microelectronic packages, solder joints ensure both electrical and mechanical connections between the printed circuit board (PCB) and the chip. During in service use, local operating temperatures increase and decrease repeatedly, exposing components of the package to thermo-mechanical strains arising from different coefficients of thermal expansion of the materials involved including the solder joints. These cyclic mechanical strains in the solder lead to thermo-mechanical fatigue crack initiation and propagation that can lead to solder joint failure. In addition to thermomechanical fatigue, solder joints can also be subjected to mechanical fatigue when the board or substrate is bent during mechanical handling or from vibration forces.
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  • 批准号:
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  • 项目类别:
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  • 财政年份:
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  • 批准号:
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  • 项目类别:
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  • 资助金额:
    $2.04万
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  • 批准号:
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  • 项目类别:
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  • 资助金额:
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