High strain rate fracture of solder joints and underfill adhesives
High strain rate fracture of solder joints and underfill adhesives
批准号:
401218-2010
负责人:
Spelt, Jan
金额:
$2.33万
依托单位:
依托单位国家:
加拿大
项目类别:
Collaborative Research and Development Grants
财政年份:
2015
资助国家:
加拿大
项目状态:
已结题
起止时间:
2015-01-01 至 2016-12-31
中文摘要
目前,电子设备中用于连接元件和电路板的焊点和粘合剂的强度无法预测,需要广泛的测试和经验才能设计出可靠的产品。这对于便携设备来说尤其如此,如果它们被跌落,就会受到冲击载荷。
这项研究将开发测量焊点和微电子粘合剂的基本强度特性的方法,并使用这些方法来预测接头强度。这将使确保新产品设计足够强大,以承受他们在服务中面临的压力变得更容易。
英文摘要
At present, the strength of solder joints and adhesive used to connect components to circuit boards in electronics devices cannot be predicted, and extensive testing and experience are required to design reliable products. This is particularly true for portable devices subject to impact loads if they are dropped.
The research will develop methods to measure fundamental strength properties of solder joints and microelectronic adhesives, and use these to predict joint strength. This will make it easier to ensure that new product designs are strong enough to carry the stresses they are exposed to in service.
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资助金额:$2.84万
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批准号:RGPIN-2014-03608
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项目类别:Discovery Grants Program - Individual
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资助金额:$2.84万
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负责人:Spelt, Jan
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依托单位:
Erosive jet micro-machining and vibratory surface finishing: optimization and modeling
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批准号:RGPIN-2014-03608
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项目类别:Discovery Grants Program - Individual
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资助金额:$2.84万
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负责人:Spelt, Jan
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依托单位:
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依托单位:
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依托单位:
High Strain Rate Fracture of Solder Joints and Underfill Adhesives
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依托单位:
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依托单位:
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批准号:43506-2008
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项目类别:Discovery Grants Program - Individual
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资助金额:$2.55万
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财政年份:2009
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负责人:Spelt, Jan
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依托单位:
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批准号:43506-2008
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项目类别:Discovery Grants Program - Individual
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资助金额:$2.55万
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负责人:Spelt, Jan
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依托单位:
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