Switched sensor array for non-destructive testing

该项目旨在开发一种微波成像传感器阵列的原型，该阵列可以帮助对腐蚀和结构完整性进行无损检测。一般来说，无损检测包括在不破坏对象的情况下检查对象的方法，即采用非侵入性或非侵入性测量。在提出的原型中，微波辐射被用来检测可见的隐蔽缺陷，并评估结构退化和/或失效的严重程度。 该项目的目标应用是检测结构部件(如管道、钢架、船体板材等)的腐蚀。隐藏在绝缘或保护性覆盖物后面。这种高度敏感的传感器阵列将是可重新配置和模块化的，因此它可以很容易地应用于其他无损检测应用，例如对位于石膏板、砖或混凝土后面的明显模糊的基础设施(管道、电线和螺柱)进行成像。总体而言，该项目有可能开启一系列全新的产品和服务，目标是结构完整性检测、故障诊断、幕后成像和检测等。 该系统的主要优点是对结构故障具有高度的敏感性。这是通过采用新的射频(RF)收发器架构的传感器设计来实现的。该传感器的一些独特优势包括：(1)与现有的微波系统相比，灵敏度提高了数量级；(2)深度穿透(约数十厘米)；(3)制造成本低；(4)单面接触测试对象；(5)模块化设计，允许在不同的成像场景中重复使用所有模块，但可互换的射频前端阵列除外。

The project aims at developing a prototype of a microwave imaging sensor array that can aid in the non-destructive inspection for corrosion and structural integrity. In general, non-destructive testing encompasses methods to inspect an object without destroying it, i.e., employing non-invasive or stand-off measurements. In the proposed prototype, microwave radiation is used to detect the visibly obscured defects and to evaluate the severity of structural degradation and/or failure. The targeted application in this project is the detection of corrosion of structural components (e.g., pipes, steel frames, hull plates, etc.) hidden behind insulation or protective coverings. This highly sensitive sensor array will be reconfigurable and modular so that it can easily be applied to other non-destructive testing applications as well such as the imaging of visibly obscured infrastructure (pipes, electrical wiring and studs) located behind drywall, brick or concrete. In general, this project has the potential to open the way to a whole new line of products and services targeting structural integrity inspection, fault diagnostics, behind-the-wall imaging and detection, etc. The major advantage of the system is the high sensitivity to structural faults. This is achieved through a sensor design exploiting a new radio-frequency (RF) transceiver architecture. Some of the distinct advantages of the sensor include: (1) orders of magnitude better sensitivity compared to existing microwave systems; (2) deep penetration (on the order of tens of centimeters); (3) low fabrication cost; (4) one-sided access to the test object; (5) modular design allowing to re-use all modules in different imaging scenarios, except for the interchangeable RF front-end arrays.