Magnetic and Piezoelectric Material Selection for MEMS Current Sensor
Magnetic and Piezoelectric Material Selection for MEMS Current Sensor
批准号:
490940-2015
负责人:
Moussa, WaliedA
金额:
$1.82万
依托单位:
依托单位国家:
加拿大
项目类别:
Engage Grants Program
财政年份:
2015
资助国家:
加拿大
项目状态:
已结题
起止时间:
2015-01-01 至 2016-12-31
中文摘要
SiliconPro是一家总部设在渥太华的公司,在复杂的现场可编程门阵列和专用集成电路设备的架构、设计和验证方面与客户合作。他们已经在高性能前向纠错(FEC)中开发了硅IP,并试图在无线和光市场中利用它作为改善通信信道的一种手段。这项技术的第一个实施将是一种新型的低功耗传感器网络,用于电网中的电力监控。SiliconPro已经为这一应用开发了基于PZT的传感器宏原型,并正在与MEMS行业合作伙伴合作,将其重新设计为具有成本效益的MEMS规模版本,类似于UofA MEMS/NEMS高级设计实验室(ADL)设想的概念设计。目前商业化的一个障碍是缺乏标准的MEMS工艺来生产高强度的稀土微磁体,这种微磁体可以在MEMS规模上进行可重复的图案化和制造。同样,很少有MEMS铸造厂拥有经过验证的压电材料沉积工艺,可以生产出对所施加应变的高频变化敏感的MEMS规模的压电元件。SiliconPro正在寻找研究合作伙伴,他们可以使用最终可以引入或转移到商业工厂进行大批量、低成本制造的材料,为传感器的这两个关键元素开发解决方案。
英文摘要
SiliconPro is an Ottawa-based company partnering with customers in the architecture, design and verification of complex FPGA and ASIC devices. They have developed Silicon IP in high performance Forward Error Correction (FEC) and are attempting to exploit it in the wireless and optical markets as a means of improving communication channels. The first embodiment of this technology will be a novel, low-power sensor network to be employed in power monitoring in the Electric Power Grid. SiliconPro has developed a PZT-based macro prototype of the sensor for this application and is working with MEMS industry partners to redesign it into a cost effective MEMS-scale version, similar to the conceptual design envisioned by the UofA MEMS/NEMS Advanced Design Lab (ADL). One current roadblock to commercialization is the lack of a standard MEMS process for the production of high strength, rare earth micromagnets that can be reproducibly patterned and fabricated at the MEMS scale. Similarly, few MEMS foundries have a proven piezoelectric material deposition process that can produce a MEMS-scale piezoelectric element sensitive to high frequency variations in applied strain. SiliconPro is searching for research partners who can develop solutions for these two key elements of the sensor using materials that can eventually be introduced or transferred into a commercial fab for high volume, low cost fabrication.
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