Gold Stud Bump Flip chip Attach for Silicon Photonics Packaging

本研究项目的目的是开始评估硅光子（SiP）芯片的Au柱形凸点倒装芯片附着，用于工业合作伙伴TeraXion感兴趣的光子模块的封装。利用其在微电子封装中流行的“倒装芯片”型键合技术的科学和工业知识和专业知识，研究小组将努力确定如何在TeraXion模块的独特要求内无缝地实现这种技术。研究活动将首先包括SiP芯片的Au柱形凸点工艺的开发，然后评估可用的键合方法，以评估其与Teraxion要求的兼容性，然后进行光学测试评估，以验证键合工艺对Teraxion芯片完整性的影响。这将导致首次证明Au柱凸点倒装芯片贴附SiP组件的原理，以验证TeraXion模块转换为倒装芯片技术的潜力，并评估键合工艺的有效性，并为未来的活动提出方向。该项目的成果将为TeraXion提供更多的倒装芯片兼容键合选项的知识，并为更彻底地评估TeraXion光子模块封装的最有前途的互连选项提供途径。

The object of this research project is to initiate an assessment of Au stud bump flip chip attach of siliconphotonic (SiP) chips for the packaging of photonics modules of interest to the industrial partner TeraXion.Employing its scientific and industrial knowledge and expertise in 'flip-chip' type bonding technology prevalentin microelectronics packaging, the research team will strive to determine how such technology could beimplemented seamlessly within the unique requirements of TeraXion's modules. The research activities willfirst comprise the development of a Au stud bump process for SiP chips, then an evaluation of availablebonding approaches with the goal to assess their compatibility with TeraXion's requirements, followed by anoptical test assessment to verify the effects of the bonding process on Teraxion's chip integrity. This will resultin a first proof of principle of Au stud bump flip chip attach for SiP assembly in order to validate the potentialto transition TeraXion's modules to flip chip technologies and evaluate the effectiveness of the bonding processand propose directions for future activity. The outcome of this project will be to provide TeraXion with anincreased knowledge of flip chip-compatible bonding options and a path to more thoroughly evaluate the mostpromising interconnection options for the packaging of TeraXion photonics modules.