Robotic Manipulation for Part Racking Processes in Electroplating Lines

该Engage项目将侧重于调查自动放置电镀线机架上待电镀零件的可能方法。做这项调查的最大目的是双重的：（i）精确和详细的报告机器人操作的需要KEI电镀线和可能的解决方案;和（ii）形成后续研究和开发的机器人机械手系统货架在这样的电镀线。该项目的最终成果将是一份关于KEI电镀线上机器人操作需求和可能解决方案的详细报告，一个虚拟模型和一个自动机器人货架系统的设计细节，该系统基于已确定的高保真系统模型，所获得的虚拟系统模型也将是以后研究开发实际高性能自动化机器人的关键工具。机器人系统使用KEI。

This Engage project will focus on the investigation of possible methodologies of automating placement of partsto be plated on plating line racks. The utmost aim of doing this investigation is two-fold: (i) precise anddetailed reporting of robotic manipulation needs for KEI plating lines and possible solutions; and (ii) forming abase for follow-up research and development of robotic manipulator systems for racking in such electroplatinglines. The final outputs of the project will be a detailed report on robotic manipulation needs on KEI platinglines and possible solutions, a virtual model and design details of an automated robotic racking system basedon the identified high fidelity system model, and conceptual design of a robotic manipulation system prototype.The obtained virtual system model will also be a key tool for later research studies on development of an actualhigh performance automated robotic system for the use of KEI.