Low Temperature Interconnections for High Performance Heterogeneous Integration

为了继续通过小型化提高性能、降低成本和增加普及性，下一代创新微电子必须依赖于将当今可用的许多不同但高性能的功能和组件集成到紧凑但功能优越的系统中。在许多情况下，最佳元件与要求温度超过250°C的传统焊接工艺不兼容。选择具有足够耐温性能和/或较高成本的元件或接受温度敏感型元件的降级，这两种选择都为我们提供了机会。 因此，该项目建议进行研究，探索并将低温互连材料、结构和工艺应用到微电子封装中，从而消除高性能系统中对成本敏感的微电子组件集成的障碍。 通过与行业合作伙伴和微电子领域的全球领先者IBM加拿大公司合作，这项研究将为具有成本效益和全球竞争力的微电子产品开发出最佳的解决方案。该项目还将通过减少能源消耗和改善零部件重复使用，为环保制造做出贡献。

To continue to increase performance, reduce cost and increase ubiquity through miniaturization, the next generation of innovative microelectronics must rely on integrating many disparate but highly performing functions and components available today into compact yet functionally superior systems. In many cases, the optimal component is not compatible with traditional soldering processes that demand temperatures in excess of 250°C. The alternatives of selecting reduced performance and/or higher cost components with sufficient temperature resistance or accepting a degradation of the temperature sensitive component both leave opportunity on the table. This project therefore proposes research to explore and implement low temperature interconnection materials, structures and processes into microelectronic packaging and thus remove the barriers to the integration of cost sensitive microelectronic components in high performance systems. By collaborating with industrial partner and global leader in microelectronics, IBM Canada, the solutions derived from this research will be optimally developed for cost-effective, globally competitive microelectronics production. The project will also contribute to environmentally conscience manufacturing by reducing energy consumption and improving component re-use.