Power Electronics for the Next Generation of Electrified Vehicles

电动汽车（EV），包括电池电动汽车（BEV）、混合动力电动汽车（HEV）、插电式混合动力电动汽车（PHEV）和燃料电池电动汽车（FCEV），是减少排放和减缓气候变化的关键措施。电动汽车使用一系列电力电子（PE）系统，包括转换器，如辅助电源模块（APM），车载充电器（OBC）和电机驱动器（MD），这些都是整个动力系统的关键要素。 需要提高功率转换效率和功率密度，以提高下一代电动汽车的续航里程、性能和成本效益。功率半导体器件使用最先进的材料，如碳化硅（SiC）和氮化镓（GaN）-也称为宽带隙（WBG）器件-与仍然广泛使用的硅（Si）基器件相比，允许更高的开关频率，并被视为实现这些急需改进的关键技术。该研究计划的目标是通过设计比当前最先进的电源转换器更具成本效益，效率更高，更可靠，以支持下一代电动汽车。为了实现这一目标，我们将开发模型，算法和工具，允许设计和优化先进的集成电源模块，利用WBG器件，将成果应用于新型PE拓扑结构，电路集成方法和原型集成功率模块。然而，由于WBG器件在更高的温度下工作，因此使用它们的PE系统、组件和模块需要设计为解决热管理（TM）问题。WBG器件的高开关速度也带来了栅极驱动和电磁干扰（EMI）方面的挑战。 拟议的研究计划将考虑一系列的方法，可以通知开发新的PE拓扑结构，组件和模块，利用WBG器件，包括：最佳电路拓扑结构;功率级集成和共享;控制架构和技术;栅极驱动器集成;集成TM策略内的功率模块，以消除热界面材料层;以及高功率密度封装技术（包括新型材料和增材制造技术）。除了比功率之外，还将在项目期间解决组件和系统级别的效率提高问题。这项研究将有助于开发具有更高功率密度和效率的新型PE组件和系统，并加速下一代更高性能、更低成本的电动汽车的开发。它还将推动科学文献的发展，并通过实践经验和对电力电子的理解，帮助满足加拿大工程部门对HQP日益增长的需求，为该地区创造就业机会和增长做出贡献。

Electrified vehicles (EVs), including battery electric vehicles (BEVs), hybrid electric vehicles (HEVs), plug-in hybrid electric vehicles (PHEVs), and fuel cell electric vehicles (FCEVs), are a key measure to reduce emissions and mitigate climate change. EVs utilize a range of power electronics (PE) systems - including converters, such as auxiliary power modules (APM), onboard chargers (OBC), and motor drives (MD) - which are critical elements of the overall powertrain. Increases in power conversion efficiency and power density are needed to improve range, performance, and cost-effectiveness of the next generation of EVs. Power semiconductor devices using state-of-the-art materials, such as Silicon Carbide (SiC) and Gallium Nitride (GaN) - also known as wide band gap (WBG) devices - allow a higher switching frequency when compared with Silicon (Si) based devices that are still widely used, and are viewed as key enabling technologies to realize these much-needed improvements. The objective of the proposed research program is to support the next generation of EVs by designing power converters that are more cost effective, efficient, and reliable than the current state-of-the-art. To accomplish this, we will develop models, algorithms, and tools that allow the design and optimization of advanced and integrated power modules utilizing WBG devices, will apply the outcomes into novel PE topologies, circuit integration methods, and a prototype integrated power module. However, as WBG devices operate at higher temperatures, PE systems, components, and modules that utilize them need to be designed to address thermal management (TM) issues. The high switching speed of WBG devices also creates challenges with gate drives and electromagnetic interference (EMI). The proposed research program will consider a range of approaches that could inform the development of novel PE topologies, components, and modules that exploit WBG devices, including: optimal circuit topologies; power stage integration and sharing; control architectures and techniques; gate driver integration; integrated TM strategies within the power module to remove layers of thermal interface material; and high power-density packaging technologies (encompassing novel materials and additive manufacturing techniques). In addition to specific power, increases in efficiency at the component and system levels will be addressed over the duration of the project. The proposed research will enable the development of new PE components and systems with increased power density and efficiency and accelerate the development of the next generation of higher-performance, lower-cost electrified vehicles. It will also advance the state-of-the-art in the scientific literature and help meet the growing demand from Canada's engineering sector for HQP with hands-on experience and an understanding of power electronics, contributing to job creation and growth in the region.