Microwave and Millimeter-Wave Active Antennas for IOT Applications

5G、物联网和自动驾驶汽车应用以及其他智能通信系统迫切需要射频天线和微型发射器/接收器等先进的无线组件。本研究探讨了实现“有源天线”的新方法，即将电子/传感/放大/滤波/转换/分配元件与1-100 GHz范围内的天线紧密集成，采用先进的半导体/纳米技术器件和新兴的喷墨印刷/柔性衬底技术制造。主动组件的可重构性需要自愈和不断变化的现场条件进行探索。申请的研究项目建立在申请人在过去几年中所追求的三个主要技术重点上：开创性的FPMS技术：由申请人团队介绍的现场可编程微波基板现在得到了更充分的利用，并有望以紧凑的格式实现高度可重构的无线组件。2. 新型材料和制造技术：纳米颗粒和复合材料、先进陶瓷、微流体和印刷电子技术的出现，为实现几种低成本、环保的新型元件设计铺平了道路。3. 异构技术集成和多芯片模块：先进的GaN， Si和其他MMIC技术与新颖的多层电路天线架构的创新组合可以实现更高的功能和更高的性能成本组件。将采取一种跨越这三个重点的共同科学方法，包括多学科和综合调查。首先，研究问题的识别和定义将发生，解决关键的无线物联网技术挑战，如外形因素（即尺寸，重量，成本，材料限制），能量收集和自供电，以及功能要求（即范围，频段，全双工，可重构性等）。这将导致概念设计（即候选使能技术和系统/电路/天线架构）。接下来，将使用先进设计系统、HFSS和其他类似电路和EM软件仿真工具增强的理论/分析技术，对新型微波/毫米波无线组件进行更具体的设计和优化。预计其结果将产生重大影响。随着越来越多的产品（如家用/厨房电器、日常服装和鞋类、仓库机器人等）内置无线功能，低成本、环保、灵活、可调、自供电的无线连接变得至关重要。拟议研究中所展示的选定先进无线组件的概念验证将有助于智能自主系统的更广泛部署，为人们的福祉和加拿大经济做出积极贡献。

Advanced wireless components such as radiofrequency antennas and miniature transmitters/receivers are urgently needed for 5G, IoT and autonomous vehicle applications, among other intelligent communicating systems. This research investigates novel approaches to the realization of "active antennas", i.e. intimately integrated electronic/sensing/amplifying/filtering/converting/distributing elements with antennas in the 1-100 GHz range, fabricated with advanced semiconductor/nanotech devices and emerging inkjet printed/flexible substrate technologies. Active component reconfigurability required for self-healing and changing field conditions are to be explored. The proposed research program builds on three major technology thrusts pursued by the applicant over the past several years: 1. Pioneering FPMS technology: The Field Programmable Microwave Substrate, introduced by the applicant's team, is now being more fully exploited and holds great promise for realizing highly reconfigurable wireless components in a compact format. 2. Novel materials and fabrication techniques: The advent of nanoparticle and composite materials, advanced ceramics, microfluidics and printed electronics have paved the way for the realization of several novel component designs that are low-cost and environmentally friendly. 3. Heterogeneous technology integration and multichip modules: The innovative combination of advanced GaN, Si and other MMIC technologies with novel multilayer circuit antenna architectures can enable increased functionality and higher performance-to-cost components. A common scientific approach across these three thrusts will be taken, involving multidisciplinary and integrative investigations. First, research problem identification and definition will occur, addressing key wireless IoT technological challenges such as form factor (i.e. size, weight, cost, material constraints), energy harvesting and self-powering, and functionality requirements (i.e. range, frequency bands, full duplexing, reconfigurability, etc.). This will then lead to conceptual designs (i.e. candidate enabling technologies and system/circuit/antenna architectures). Next, a more specific design and optimization of novel microwave/mmwave wireless components will take place using theoretical/analytical techniques augmented by Advanced Design System, HFSS and other similar circuit and EM software simulation tools. The results are expected to be highly impactful. As wireless capability is built in to more and more products (e.g. home/kitchen appliances, everyday clothing and footwear, warehouse robots, etc.) the availability of low-cost, eco-friendly, flexible, tunable, self-powered wireless connectivity is of critical importance. The proofs-of-concept of selected advanced wireless components demonstrated in the proposed research will be instrumental to the wider deployment of intelligent autonomous systems, positively contributing to the well-being of people and the Canadian economy.