Microfabricated electrochemical sensors for combustion applications

Microfabricated electrochemical sensors for combustion applications
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用于燃烧应用的微加工电化学传感器

DOI:
10.1117/12.2177335
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发表时间:
2015
期刊:
SPIE Proceedings
影响因子:
--
通讯作者:
Carpenter, Michael A.
Carpenter, Michael A.
中科院分区:
--
文献类型:
--
作者:
Senesky, Debbie G.;Dekate, Sachin;Vulcano Rossi, Vitor A.;Mullen, Max R.;Karker, Nicholas A.;Zhao, Zhouying;Kowarz, Marek W.;Dutta, Prabir K.;Carpenter, Michael A.

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基于硅微加工技术在阿贡国家实验室和俄亥俄州州立大学研制的cm尺寸氧传感器上的应用,提出了一种新的氧传感器小型化设计方案,该方案将金属/金属氧化物密封在结构内,提供集成的氧参考。所建议的结构和工艺变化将导致一种新型的基于MEMS的器件满足半导体行业的成本效率和大规模生产标准。MEMS设计需要薄膜沉积来产生YSZ膜、氧化钯参考和铂电极。铂电极的操作条件下,确保长期使用的膜导电性进行了研究。SEM成像证实了扩展测试后的空隙形成,与文献一致。此外,亲水键合对硅芯片样品含有YSZ膜和氧化钯进行了讨论,以创建气密密封的腔氧参考。在硅芯片背面引入拉伸Si 3 N4薄膜会导致芯片弯曲,从而影响键合质量。这种效果通过在初始结合阶段施加压力来控制。此外,KOH蚀刻的键合芯片样品进行了讨论,和一个YSZ膜,其特征在于通过拉曼光谱的蚀刻步骤的生存。
A new design for the miniaturization of an existing oxygen sensor is proposed based on the application of silicon microfabrication technologies to a cm sized O2sensor demonstrated by Argonne National Laboratory and The Ohio State University which seals a metal/metal oxide within the structure to provide an integrated oxygen reference. The structural and processing changes suggested will result in a novel MEMS-based device meeting the semiconductor industry standards for cost efficiency and mass production. The MEMS design requires thin film depositions to create a YSZ membrane, palladium oxide reference and platinum electrodes. Pt electrodes are studied under operational conditions ensuring film conductivity over prolonged usage. SEM imaging confirms void formation after extended tests, consistent with the literature. Furthermore, hydrophilic bonding of pairs of silicon die samples containing the YSZ membrane and palladium oxide is discussed in order to create hermetic sealed cavities for oxygen reference. The introduction of tensile Si3N4films to the backside of the silicon die generates bowing of the chips, compromising bond quality. This effect is controlled through the application of pressure during the initial bonding stages. In addition, KOH etching of the bonded die samples is discussed, and a YSZ membrane that survives the etching step is characterized by Raman spectroscopy.
DOI: 10.1002/9781118071748
发表时间: 2010
影响因子: 3.2
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DOI: --
发表时间: 1996
期刊:
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发表时间: 1972-01-01
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作者:
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DOI: 10.1143/jjap.37.2007
发表时间: 1998-04-01
期刊: JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS
影响因子: --
作者:
Maeder, T;Sagalowicz, L;Muralt, P
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DOI: 10.1116/1.589070
发表时间: 1996-07
影响因子: 1.4
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