Ultra-Thin Flexible Encapsulating Materials for Soft Bio-Integrated Electronics.
Ultra-Thin Flexible Encapsulating Materials for Soft Bio-Integrated Electronics.
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DOI：
10.1002/advs.202202980
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发表时间：
2022-10
期刊：
影响因子：
15.1
通讯作者：
Yu, Ki Jun
中科院分区：
文献类型：
--
作者：
Sang, Mingyu;Kim, Kyubeen;Shin, Jongwoon;Yu, Ki Jun
关键词：
近年来，生物电子器件通过灵活的生物兼容材料和电子设计的融合进行了广泛的研究和开发，使人类医疗保健中能够进行更精确的诊断和治疗，并开辟了扩展到临床医学和生物医学研究等各个领域的潜力。为了建立准确、稳定的双向生物接口，防护外部环境和高机械变形是可穿戴生物电子器件的关键。在可植入生物电子学的情况下，需要特殊的封装材料和优化的机械设计和配置来提供电子稳定性和功能，以适应生物流体环境中的各种器官特性、寿命和功能。在这里，这项研究介绍了采用新型材料的超薄封装的最新进展，这种封装可以保持甚至改善可穿戴和可植入生物集成电子设备的电气性能，从而支持防止破坏和污染的安全性和稳定性，以及优化生物电子系统在生理环境中的使用。此外，还介绍了最广泛使用的封装技术的材料、方法和特点，从而为最近开发的柔性生物电子学的适当选择提供了战略选择。本文从柔性生物电子封装的先进材料的开发和多功能柔性生物集成电子的新方案的发明开始，重点介绍了最新的进展和趋势。通过将这篇综述分为可穿戴和可植入电子部分，它将帮助读者做出适当的选择，了解材料的使用，并使各个应用领域的发展成为可能。
Recently, bioelectronic devices extensively researched and developed through the convergence of flexible biocompatible materials and electronics design that enables more precise diagnostics and therapeutics in human health care and opens up the potential to expand into various fields, such as clinical medicine and biomedical research. To establish an accurate and stable bidirectional bio‐interface, protection against the external environment and high mechanical deformation is essential for wearable bioelectronic devices. In the case of implantable bioelectronics, special encapsulation materials and optimized mechanical designs and configurations that provide electronic stability and functionality are required for accommodating various organ properties, lifespans, and functions in the biofluid environment. Here, this study introduces recent developments of ultra‐thin encapsulations with novel materials that can preserve or even improve the electrical performance of wearable and implantable bio‐integrated electronics by supporting safety and stability for protection from destruction and contamination as well as optimizing the use of bioelectronic systems in physiological environments. In addition, a summary of the materials, methods, and characteristics of the most widely used encapsulation technologies is introduced, thereby providing a strategic selection of appropriate choices of recently developed flexible bioelectronics. This review highlights the latest progress and trends, beginning with the development of advanced materials for encapsulations for flexible bioelectronics and the invention of new schemes for multifunctional flexible bio‐integrated electronics. By dividing this review into wearable and implantable electronics sections, it will help readers make appropriate choices and understand the use of materials and enable the development of various application fields.
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DOI：
10.1016/b978-0-08-100970-3.00001-8
发表时间：
2018-01-01
期刊：
BIODEGRADABLE AND BIOCOMPATIBLE POLYMER COMPOSITES: PROCESSING, PROPERTIES AND APPLICATIONS
影响因子：
--
作者：
Balaji, Anand B.;Pakalapati, Harshini;Siddiqui, Humaira
通讯作者：
Siddiqui, Humaira
影响因子：
7.9
作者：
Burton A;Won SM;Sohrabi AK;Stuart T;Amirhossein A;Kim JU;Park Y;Gabros A;Rogers JA;Vitale F;Richardson AG;Gutruf P
通讯作者：
Gutruf P
影响因子：
10
作者：
Choi, Jungil;Kang, Daeshik;Rogers, John A.
通讯作者：
Rogers, John A.
影响因子：
34.3
作者：
Boutry, Clementine M.;Kaizawa, Yukitoshi;Bao, Zhenan
通讯作者：
Bao, Zhenan
影响因子：
2.9
作者：
Berdova, Maria;Liu, Xuwen;Franssila, Sami
通讯作者：
Franssila, Sami