Influence of Substrate Temperature on Structural Properties and Deposition Rate of AlN Thin Film Deposited by Reactive Magnetron Sputtering
Influence of Substrate Temperature on Structural Properties and Deposition Rate of AlN Thin Film Deposited by Reactive Magnetron Sputtering
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基片温度对反应磁控溅射AlN薄膜结构性能和沉积速率的影响
DOI:
10.1007/s11664-012-1999-4
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发表时间:
2012-03
影响因子:
2.1
通讯作者:
Wang, Demiao
中科院分区:
文献类型:
--
作者:
Jin, Hao;Feng, Bin;Dong, Shurong;Zhou, Changjian;Zhou, Jian;Yang, Yi;Ren, Tianling;Luo, Jikui;Wang, Demiao
Aluminum nitride (AlN) thin films withc-axis preferred orientation have been prepared by reactive direct-current (DC) magnetron sputtering. The degree of preferred crystal orientation, the cross-sectional structure, and the surface morphology of AlN thin films grown on Si (100) substrates at various substrate temperatures from 60°C to 520°C have been investigated by x-ray diffraction, scanning electron microscopy, and atomic force microscopy. Results show that the substrate temperature has a significant effect on the structural properties, such as the degree ofc-axis preferred orientation, the full-width at half-maximum (FWHM) of the rocking curve, the surface morphology, and the cross-sectional structure as well as the deposition rate of the AlN thin films. The optimal substrate temperature is 430°C, with corresponding root-mean-square surface roughness (Rrms) of 1.97 nm, FWHM of AlN (002) diffraction of 2.259°, and deposition rate of 20.86 nm/min. The mechanisms behind these phenomena are discussed. Finally, film bulk acoustic resonators based on AlN films were fabricated; the corresponding typical electromechanical coupling coefficient (kt2) is 5.1% with series and parallel frequencies of 2.37 GHz and 2.42 GHz, respectively.
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影响因子:
2.1
作者:
T. Hu;S. Mao;C. Chao;M. F. Wu;Hsing-Lu Huang;D. Gan
通讯作者:
T. Hu;S. Mao;C. Chao;M. F. Wu;Hsing-Lu Huang;D. Gan
影响因子:
2.1
作者:
Y. Xi;K. Chen;F. Mont;J. K. Kim;E. Schubert;C. Wetzel;W. Liu;X. Li;J. Smart
通讯作者:
Y. Xi;K. Chen;F. Mont;J. K. Kim;E. Schubert;C. Wetzel;W. Liu;X. Li;J. Smart
影响因子:
2.1
作者:
M. Ishihara;H. Yumoto;T. Tsuchiya;K. Akashi
通讯作者:
M. Ishihara;H. Yumoto;T. Tsuchiya;K. Akashi
影响因子:
2.1
作者:
S. Hullavarad;R. Vispute;B. Nagaraj;V. N. Kulkarni;S. Dhar;T. Venkatesan;K. Jones;M. Derenge;T. Zheleva;M. Ervin;A. Lelis;C. Scozzie;D. Habersat;A. Wickenden;L. Currano;M. Dubey
通讯作者:
S. Hullavarad;R. Vispute;B. Nagaraj;V. N. Kulkarni;S. Dhar;T. Venkatesan;K. Jones;M. Derenge;T. Zheleva;M. Ervin;A. Lelis;C. Scozzie;D. Habersat;A. Wickenden;L. Currano;M. Dubey
影响因子:
4.1
作者:
T. Leung;C. Ong
通讯作者:
T. Leung;C. Ong