Rhenium Alloys as Ductile Substrates for Diamond Thin-Film Electrodes.
Rhenium Alloys as Ductile Substrates for Diamond Thin-Film Electrodes.
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DOI：
10.1016/j.diamond.2013.11.010
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发表时间：
2014-02-01
影响因子：
4.1
通讯作者：
Martin, Heidi B.
中科院分区：
文献类型：
--
作者：
Halpern, Jeffrey M.;Martin, Heidi B.
研究了钼-铼（Mo/Re）和钨-铼（W/Re）合金作为薄膜多晶硼掺杂金刚石电极的基底。传统的形成碳化物的金属基材与金刚石牢固地粘附，但在暴露于高温（1000°C）金刚石化学气相沉积环境期间失去其延展性。在Mo/Re（47.5/52.5wt.%）的一端选择性沉积硼掺杂半金属金刚石长达20小时和W/Re（75/25重量%）合金丝共形金刚石薄膜的合金上显示的晶粒尺寸和拉曼签名类似于钨上生长的薄膜，在所有情况下，形态和拉曼光谱是一致的，以及多面的，微晶金刚石与最小的sp2碳含量。多巴胺在磷酸盐缓冲液（PBS）中的循环伏安图显示了高质量金刚石电极的宽窗口和低基线电流。此外，该膜显示出一致的明确的多巴胺电化学氧化还原活性。未涂覆但仍暴露于金刚石生长环境的Mo/Re衬底区域在弯曲-断裂旋转测试中保持比钨大得多的柔性，弯曲至90°的测试最大值且不断裂。W/Re基体在27°弯曲后断裂，钨基体在21°弯曲后断裂。观察到钨和W/Re的脆性，穿晶解理断裂表面。在先前的弯曲试验之后，Mo/Re的拉伸诱导断裂显示出具有可见的韧性芯的韧窝断裂。总体而言，Mo/Re和W/Re合金是适合金刚石生长的衬底。在金刚石生长之后，Mo/Re合金比传统的钨基底保持显著更大的延展性，并且因此可以是用于更大延展性的薄膜金刚石电极的有吸引力的金属基底。
Molybdenum-rhenium (Mo/Re) and tungsten-rhenium (W/Re) alloys were investigated as substrates for thin-film, polycrystalline boron-doped diamond electrodes. Traditional, carbide-forming metal substrates adhere strongly to diamond but lose their ductility during exposure to the high-temperature (1000°C) diamond, chemical vapor deposition environment. Boron-doped semi-metallic diamond was selectively deposited for up to 20 hours on one end of Mo/Re (47.5/52.5 wt.%) and W/Re (75/25 wt.%) alloy wires. Conformal diamond films on the alloys displayed grain sizes and Raman signatures similar to films grown on tungsten; in all cases, the morphology and Raman spectra were consistent with well-faceted, microcrystalline diamond with minimal sp2 carbon content. Cyclic voltammograms of dopamine in phosphate-buffered saline (PBS) showed the wide window and low baseline current of high-quality diamond electrodes. In addition, the films showed consistently well-defined, dopamine electrochemical redox activity. The Mo/Re substrate regions that were uncoated but still exposed to the diamond-growth environment remained substantially more flexible than tungsten in a bend-to-fracture rotation test, bending to the test maximum of 90° and not fracturing. The W/Re substrates fractured after a 27° bend, and the tungsten fractured after a 21° bend. Brittle, transgranular cleavage fracture surfaces were observed for tungsten and W/Re. A tension-induced fracture of the Mo/Re after the prior bend test showed a dimple fracture with a visible ductile core. Overall, the Mo/Re and W/Re alloys were suitable substrates for diamond growth. The Mo/Re alloy remained significantly more ductile than traditional tungsten substrates after diamond growth, and thus may be an attractive metal substrate for more ductile, thin-film diamond electrodes.
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影响因子：
4.1
作者：
Halpern, Jeffrey M.;Cullins, Miranda J.;Martin, Heidi B.
通讯作者：
Martin, Heidi B.
影响因子：
2.7
作者：
Hess, Allison E.;Sabens, David M.;Zorman, Christian A.
通讯作者：
Zorman, Christian A.
影响因子：
4.1
作者：
Puzyr, A. P.;Baron, A. V.;Bondar, V. S.
通讯作者：
Bondar, V. S.
影响因子：
4.1
作者：
Halpern, JM;Xie, ST;Martin, HB
通讯作者：
Martin, HB
影响因子：
4.2
作者：
Park, Jinwoo;Quaiserova-Mocko, Veronika;Swain, Greg M.
通讯作者：
Swain, Greg M.