Optical and thermal performance of nitride-based thin-film flip-chip light-emitting diodes
Optical and thermal performance of nitride-based thin-film flip-chip light-emitting diodes
复制标题
氮化物基薄膜倒装发光二极管的光学和热性能
DOI：
10.1007/s10854-018-0110-1
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发表时间：
2018-10
期刊：
影响因子：
--
通讯作者：
Liu Yi Jun
中科院分区：
文献类型：
--
作者：
Liu Wen Jie;Hu Xiao Long;Liu Yi Jun
Nitride-based light-emitting diodes (LEDs) were fabricated based on initial patterned sapphire substrate by thin film (TF) and flip-chip (FC) techniques. An enhancement of 7.7% in light output power was first obtained by optimizing the p-type contact layer. Then, periodic patterned surface was optimized by wet etching after removal of the sapphire substrate, and the light output power of the TFFC-LEDs was enhanced by 19.8% as compared to that of the TFFC-LEDs with original patterned surface. The device performance characteristic including illuminant pattern, emission wavelength movement and junction temperature variation of the optimized TFFC-LEDs were shown as compared with commercialized LEDs. The results indicate that the TFFC-LEDs possess uniform current distribution and lower junction temperature, thus show promising applications in various areas such as automotive lighting, illegal capture and solid-state lighting.
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影响因子：
2.6
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DOI：
10.1007/s10854-015-2846-1
发表时间：
2015-02
期刊：
Journal of Materials Science: Materials in Electronics
影响因子：
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作者：
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