Effect of Nano-Sized TiN Additions on the Electrical Properties of Vacuum Cold Sprayed SiC Coatings

Effect of Nano-Sized TiN Additions on the Electrical Properties of Vacuum Cold Sprayed SiC Coatings
复制标题

纳米TiN添加对真空冷喷涂SiC涂层电性能的影响

DOI:
10.1007/s11666-010-9544-6
复制
发表时间:
2010-08
影响因子:
3.1
通讯作者:
Liu, Y.
Liu, Y.
中科院分区:
材料科学2区
文献类型:
--
作者:
Kusumoto, K.;Wang, Y. -Y.;Feng, J. -J.;Yang, G. -J.;Liu, Y.

文献摘要

参考文献

被引文献

相似文献

将三种不同含量的20 nm的纳米TiN粉末加入到40 nm的纳米SiC粉末中。采用真空冷喷涂工艺在Al 2 O3基体上制备了存款SiC-TiN复合涂层。利用扫描电镜(SEM)和X射线衍射(XRD)对样品的微观结构和相结构进行了分析。使用四点探针法测量了该涂层的薄层电阻。研究了TiN添加量对SiC-TiN复合涂层电阻率的影响及其导电机理。SiC-TiN涂层的电阻率随TiN含量的增加而降低,当TiN含量为50mol%时,电阻率达到最小值1.82 Ω m。
Three different contents of nano-sized TiN powers of 20 nm in size were added to nano-sized SiC powders of 40 nm. Vacuum cold spray (VCS) process was used to deposit SiC-TiN composite coatings on Al2O3substrates. Microstructure and phase structure analysis of the samples was performed by scanning electron microscopy (SEM) and x-ray diffraction (XRD). Sheet resistance of the VCS coatings was measured using a four-point probe method. The influences of TiN additions on the electrical resistivity of SiC-TiN composite coatings and the conductive mechanisms were investigated. The electrical resistivity of SiC-TiN coatings decreases with increasing TiN contents, reaching a minimum of 1.82 Ω m with 50 mol% TiN.
DOI: 10.1016/j.microrel.2007.01.014
发表时间: 2007-04
期刊: Microelectron. Reliab.
影响因子: --
作者:
D. Nguyen;Dong-Jin Kim;B. Kang;Chang Soo Kim;Soon-Gil Yoon
通讯作者: D. Nguyen;Dong-Jin Kim;B. Kang;Chang Soo Kim;Soon-Gil Yoon
DOI: 10.1007/s11666-010-9541-9
发表时间: 2010-08
影响因子: 3.1
作者:
Y. Wang;Y. Liu;G. Yang;J. Feng;K. Kusumoto
通讯作者: Y. Wang;Y. Liu;G. Yang;J. Feng;K. Kusumoto
DOI: 10.1016/j.mseb.2008.12.041
发表时间: 2009-04
影响因子: 3.6
作者:
Hyung-jun Kim;Y. Yoon;Joo-Hyung Kim;S. Nam
通讯作者: Hyung-jun Kim;Y. Yoon;Joo-Hyung Kim;S. Nam
DOI: 10.1016/s1003-6326(07)60101-0
发表时间: 2007-04
期刊: --
影响因子: --
作者:
Jicheng Zhou;Xuqiang Zheng
通讯作者: Jicheng Zhou;Xuqiang Zheng
DOI: 10.1016/j.tsf.2009.01.045
发表时间: 2009-04
期刊: Thin Solid Films
影响因子: 2.1
作者:
Yoshiki Hoshide;A. Tabata;A. Kitagawa;A. Kondo
通讯作者: Yoshiki Hoshide;A. Tabata;A. Kitagawa;A. Kondo