Contact mechanics and friction processes in ultrasonic wire bonding - Basic theories and experimental investigations
Contact mechanics and friction processes in ultrasonic wire bonding - Basic theories and experimental investigations
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超声波引线键合中的接触力学和摩擦过程 - 基础理论和实验研究
DOI：
10.1016/j.jsv.2019.115021
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发表时间：
2020
影响因子：
4.7
通讯作者：
Wallaschek
中科院分区：
文献类型：
--
作者：
Twiefel;Wallaschek
超声波引线键合技术在电子封装工业中已经应用了几十年，但是键合过程中的接触和摩擦条件还没有得到很好的理解。在这项工作中，在导线/基体界面和导线/工具界面的相对运动，以及氧化物和微焊缝的影响，在导线/基体界面的摩擦一起，系统和全面地分析在这两个界面的接触和摩擦。特别是在电线/基板界面的分析，接触被分为三个不同的区域，其中存在不同的氧化物去除和微焊缝形成条件。理论分析得到了验证，从侧面和底部的实时观察。这两种分析表明，在开始阶段，工具和导线耦合良好。线在基底上滑动，并且最大的摩擦发生在内周区域中。在此阶段，通过实验观察到工具平衡位置的偏移。随着工艺的进行，导线和基板之间的接触面积变大。在接触区域内，氧化物层被破碎成颗粒，然后被输送到外围接触区域。在无氧化物区域中形成微焊缝。滑动摩擦和微焊缝连接共存的导线/基板界面。随着更多的氧化物被去除并且更多的微焊缝被形成，焊丝/基底界面处的相对位移变得更小，而焊丝/工具界面处的相对位移变得更大。最后，微焊缝覆盖大部分接触。对超声波引线键合过程中接触和摩擦的理解，对工业生产中的工艺有潜在的促进作用。
Even though ultrasonic (US) wire bonding has been a popular interconnection technique in electronic packaging industry for decades, the contact and friction conditions during the bonding processes have not been well understood. In this work, the relative motion at the wire/substrate interface and the wire/tool interface, and the influences of oxides and microwelds on the friction at the wire/substrate interface are brought together to systematically and comprehensively analyze the contact and friction at the two interfaces. Specifically for the analysis at the wire/substrate interface, the contact was divided into three different areas where different oxide removal and microweld formation conditions exist. The theoretical analysis was then validated by real-time observations from both side and bottom view. Both analyses show that in the beginning stage, the tool and the wire are well coupled. The wire gross-slides on the substrate and the most substantial friction takes place in the inner peripheral region. The shift of the tool equilibrium position was experimentally observed during this stage. As the process goes on, the contact area between the wire and the substrate gets larger. Within the contact area, the oxide layer is broken into particles and then transported to the peripheral contact region. Microwelds are formed in the oxide-free areas. Sliding friction and microweld connections coexist at the wire/substrate interface. As more oxides are removed and more microwelds are formed, the relative displacement at the wire/substrate interface becomes smaller while the relative displacement at the wire/tool interface becomes larger. Finally, microwelds cover the majority of the contact. The understanding on the contact and friction during US wire bonding leads to a potential enhancement of the processes in industry production.
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