Quantification of the Energy Flows During Ultrasonic Wire Bonding Under Different Process Parameters
Quantification of the Energy Flows During Ultrasonic Wire Bonding Under Different Process Parameters
复制标题
不同工艺参数下超声波引线键合过程中能量流的量化
DOI：
10.1007/s40684-019-00061-0
复制
发表时间：
2019
影响因子：
4.2
通讯作者：
Wallaschek
中科院分区：
文献类型：
--
作者：
Schneider;Hermsdorf;Twiefel;Wallaschek
超声波引线键合在微电子封装领域有着广泛而长期的应用，但对其键合机理的定量研究还很缺乏。在这项工作中，基于实时观察来量化US键合过程中从电输入能量到不同机制的能量流动，通过实时观察可以检测导线/衬底和导线/工具界面处的相对运动。两个界面的相对运动被证明是由连续塑性变形和US振动引起的。法向力和超声功率相互影响相对运动幅度。推导的能量流表明，换能器输出的能量主要流向界面处的振动摩擦和微焊缝的形成、变形和断裂。尽管其他机制对这一过程很重要，但它们只获得很少的能量。定量研究了法向力、超声功率和时间等工艺参数对能量流的影响。法向力和US功率的良好耦合将更多能量引导到微焊缝的形成，而长的处理时间将增加摩擦引起的能量消耗。
Despite of its wide and long-term application for interconnections in the field of microelectronics packaging, a quantitative understanding on the mechanisms of ultrasonic (US) wire bonding is still lacked. In this work, the energy flows from the electrical input energy to the different mechanisms during the US bonding process are quantified based on real-time observations via which the relative motions at the wire/substrate and the wire/tool interfaces can be detected. The relative motions at the two interfaces are proved to be caused by both the continuous plastic deformation and the US vibration. The normal force and US power interdependently affect the relative motion amplitudes. The deduced energy flows show that the energy from the transducer mainly flows to the vibration induced friction at the two interfaces and the microwelds formation, deformation and breakage. Despite of their significance to the process, the other mechanisms receive only little amount of energy. The impacts of the process parameters including normal force, US power and time on the energy flows are quantitatively investigated. A good coupling of the normal force and the US power guides more energy to the formation of microwelds while a long process time would increase the friction induced energy consumption.
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