Microstructural evolution, mechanical properties and strengthening mechanism of TiN/Ni nanocomposite film
Microstructural evolution, mechanical properties and strengthening mechanism of TiN/Ni nanocomposite film
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TiN/Ni纳米复合薄膜的微观结构演变、力学性能及强化机制
DOI：
10.1016/j.jallcom.2016.08.147
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发表时间：
2017-01
影响因子：
6.2
通讯作者：
Daihua He
中科院分区：
文献类型：
--
作者：
Wei Li;Ping Liu;Su Zhao;Ke Zhang;Fengcang Ma;Xinkuan Liu;Xiaohong Chen;Daihua He
采用反应磁控溅射法制备了一系列不同Ni含量的TiN/Ni纳米复合薄膜。研究了TiN/Ni纳米复合薄膜的组织演变、力学性能及强化机理。当Ni：Ti比小于1：24时，少量Ni固溶于TiN基体中，导致硬度和弹性模量略有下降。当Ni：Ti比增加到4：21时，由于热力学不相容性，Ni倾向于作为界面相从TiN中分离出来，并与相邻的TiN晶粒共格生长。结果表明，TiN/Ni薄膜的硬度和弹性模量分别达到33.3GPa和373 GPa，具有显著的强化效果。当Ni：Ti比进一步增加到5：20时，Ni界面转变为非晶态，导致外延生长结构的破坏，硬度和弹性模量迅速下降。TiN/Ni纳米复合薄膜的强化作用归因于Ni界面层与TiN晶粒间的共格界面。
A series of TiN/Ni nanocomposite films with different Ni content were synthesized by reactive magnetron sputtering. The microstructural evolution, mechanical properties and strengthening mechanism of TiN/Ni nanocomposite film were studied. When Ni:Ti ratio is less than 1:24, the small amount of Ni can be dissolved in the TiN matrix, leading to the slight decrease of the hardness and elastic modulus. When Ni:Ti ratio rises to 4:21, Ni inclines to separate from TiN due to the thermodynamic incompatibility as an interfacial phase and grow coherently with adjacent TiN crystallites. As a result, the TiN/Ni film was remarkably strengthened with the maximal hardness and elastic modulus of 33.3 GPa and 373 GPa. As Ni:Ti ratio further increases to 5:20, Ni interface transforms into amorphous state, leading to the destruction of the epitaxial growth structure and the rapid decrease of hardness and elastic modulus. The strengthening effect of TiN/Ni nanocomposite film can be attributed to the coherent interface between Ni interfacial layers and TiN crystallites.
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影响因子：
5.4
作者：
S. Vepřek;A. Niederhofer;K. Moto;T. Bolom;H.-D. Männling;P. Nesládek;G. Dollinger;A. Bergmaier
通讯作者：
S. Vepřek;A. Niederhofer;K. Moto;T. Bolom;H.-D. Männling;P. Nesládek;G. Dollinger;A. Bergmaier
CrAlN/SiC纳米多层膜中非晶SiC的结晶及超硬度效应
影响因子：
5.4
作者：
Li, Wei1;Liu, Ping1;Zhao, Yongsheng2;Ma, Fengcang1;Liu, Xinkuan1;Chen, Xiaohong1;He, Daihua1
通讯作者：
He, Daihua1
影响因子：
5.4
作者：
R. Andrievski
通讯作者：
R. Andrievski
影响因子：
5.4
作者：
J. Šůna;J. Musil;Václav Ondok;Jeung-Whan Han
通讯作者：
J. Šůna;J. Musil;Václav Ondok;Jeung-Whan Han
影响因子：
5.4
作者：
J. Musil;H. Poláková
通讯作者：
J. Musil;H. Poláková