A Transient Liquid Phase Sintering Bonding Process Using Nickel-Tin Mixed Powder for the New Generation of High-Temperature Power Devices
A Transient Liquid Phase Sintering Bonding Process Using Nickel-Tin Mixed Powder for the New Generation of High-Temperature Power Devices
复制标题
用于新一代高温功率器件的镍锡混合粉末瞬态液相烧结键合工艺
DOI：
10.1007/s11664-017-5357-4
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发表时间：
2017-02
影响因子：
2.1
通讯作者：
Chen Shuhai
中科院分区：
文献类型：
--
作者：
Feng Hongliang;Huang Jihua;Yang Jian;Zhou Shaokun;Zhang Rong;Chen Shuhai
Ni-Sn TLPS 键合是一种瞬态液相烧结 (TLPS) 键合工艺，专为新一代功率半导体封装而开发。以30Ni-70Sn混合粉末为反应体系，组装了模型Ni/Ni-Sn/Ni夹层结构。结果表明，结合层由Ni3Sn4和残留的细小Ni颗粒组成，并含有少量Ni3Sn2，在340℃下保温240 min，耐热温度高于790℃。还分别研究了在 300°C 和 340°C 不同时间下粘合层的微观结构演变和热特性。这表明，在300°C恒温240 min和340°C恒温180 min后，Sn已完全转化为Ni-Sn金属间化合物（IMCs），并且结合层主要由Ni3Sn4和残留的Ni颗粒组成。接头力学性能分析结果表明，340℃、240min时粘结层硬度均匀，平均值达到3.66GPa，接近Ni3Sn4块体材料的硬度。剪切试验表明，随着340℃保温时间从60min增加到180min，由于Sn的存在，室温与350℃之间的剪切强度差距较大。但当保温时间为 180 分钟或更长时，Sn 已完全转化为 Ni-Sn IMC。无论是在室温还是350°C下，它们的性能都非常相似。
A transient liquid phase sintering (TLPS) bonding process, Ni-Sn TLPS bonding was developed for the new generation of power semiconductor packaging. A model Ni/Ni-Sn/Ni sandwiched structure was assembled by using 30Ni-70Sn mixed powder as the reactive system. The results show that the bonding layer is composed of Ni3Sn4and residual fine Ni particles with a small amount of Ni3Sn2at 340°C for 240 min, which has a heat-resistant temperature higher than 790°C. The microstructural evolution and thermal characteristic of the bonding layer for various times at 300°C and 340°C were also studied, respectively. This reveals that, after isothermally holding for 240 min at 300°C and for 180 min at 340°C, Sn has been completely transformed into Ni-Sn intermetallic compounds (IMCs) and the bonding layer is mainly composed of Ni3Sn4and residual Ni particles. The analysis result for the mechanical properties of the joint shows that the hardness of the bonding layer at 340°C for 240 min is uniform and that the average value reaches 3.66 GPa, which is close to that of the Ni3Sn4block material. The shear test shows that, as the holding time increases from 60 min to 180 min at 340°C, because of the existence of Sn, the disparity of shear strength between room temperature and 350°C is large. But when the holding time is 180 min or longer, Sn has been completely transformed into Ni-Sn IMCs. Their performances are very similar whether at room temperature or 350°C.
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影响因子：
9.4
作者：
Bosco, NS;Zok, FW
通讯作者：
Zok, FW
影响因子：
6
作者：
Wang, Shuai;Li, Mingyu;Wang, Chunqing
通讯作者：
Wang, Chunqing
DOI：
10.2298/jmmb121123052o
发表时间：
2012
期刊：
Journal of Mining and Metallurgy, Section B
影响因子：
--
作者：
I. Ohnuma;R. Kainuma;K. Ishida
通讯作者：
I. Ohnuma;R. Kainuma;K. Ishida
DOI：
10.1007/s11661-006-0166-z
发表时间：
2006
期刊：
Metallurgical and Materials Transactions A
影响因子：
--
作者：
T. D'hondt;S. Corbin
通讯作者：
T. D'hondt;S. Corbin
影响因子：
--
作者：
P. Quintero;F. McCluskey
通讯作者：
P. Quintero;F. McCluskey