A Study on Equivalent Circuit Modeling of Wiring Inductance in SiC Power Module for Predicting Conducted EMI of Power Converter
A Study on Equivalent Circuit Modeling of Wiring Inductance in SiC Power Module for Predicting Conducted EMI of Power Converter
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用于预测功率转换器传导 EMI 的 SiC 功率模块接线电感等效电路建模研究
DOI:
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发表时间:
2020
期刊:
影响因子:
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通讯作者:
K. Nakahara
中科院分区:
文献类型:
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作者:
C. Kyotani;T. Ibuchi;T. Funaki;T. Miyazaki;Y. Okawauchi;K. Nakahara
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DOI:
10.1109/emceurope.2017.8094780
发表时间:
2017
期刊:
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE
影响因子:
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作者:
Keita Takahashi;T. Ibuchi;T. Funaki
通讯作者:
T. Funaki
DOI:
10.1109/iwipp.2017.7936770
发表时间:
2017
期刊:
2017 IEEE International Workshop On Integrated Power Packaging (IWIPP)
影响因子:
--
作者:
T. Ibuchi;Eisuke Masuda;T. Funaki;H. Otake;T. Miyazaki;Yasuo Kanetake;Takashi Nakamura
通讯作者:
Takashi Nakamura
DOI:
10.1109/emccompo.2017.7998085
发表时间:
2017
期刊:
2017 11th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMCCompo)
影响因子:
--
作者:
A. Boyer;Manuel Antero;Gonzalez Sentis;C. Ghfiri;A. Durier;Modeling;M. A. Sentis
通讯作者:
M. A. Sentis
DOI:
10.1109/jestpe.2019.2919349
发表时间:
2019-09
影响因子:
5.5
作者:
Yue Xie;Cai Chen;Zhizhao Huang;Teng Liu;Yong Kang;F. Luo
通讯作者:
Yue Xie;Cai Chen;Zhizhao Huang;Teng Liu;Yong Kang;F. Luo
影响因子:
4.3
作者:
K. Coperich;A. Ruehli;A. Cangellaris
通讯作者:
A. Cangellaris