On-line thickness measurement for two-layer systems on polymer electronic devices.
On-line thickness measurement for two-layer systems on polymer electronic devices.
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DOI：
10.3390/s131115747
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发表时间：
2013-11-18
期刊：
影响因子：
--
通讯作者：
El-Khozondar HJ
中科院分区：
文献类型：
--
作者：
Grassi AP;Tremmel AJ;Koch AW;El-Khozondar HJ
在印刷电子电路的制造过程中，不同的涂层被连续地施加在基底上。这些层的正确厚度对于保证最终产品的电子性能至关重要，因此必须彻底控制。本文提出了一种通过薄膜反射计（TFR）测量两层系统的模型。该模型考虑了不规则的界面和变形所引入的设置和垂直振动运动所造成的生产过程。结果表明，引入这些变量是必不可少的，以获得正确的厚度值。所提出的方法被施加到一个典型的配置的聚合物电子在透明和不透明的基板上。我们将我们的结果与使用轮廓仪获得的结果进行比较。两种测量之间的高度一致性验证了模型，并表明所提出的测量方法可用于需要快速和非接触式检测两层系统的工业应用。此外，这种方法可以用于其他类型的材料与已知的光学参数。
During the manufacturing of printed electronic circuits, different layers of coatings are applied successively on a substrate. The correct thickness of such layers is essential for guaranteeing the electronic behavior of the final product and must therefore be controlled thoroughly. This paper presents a model for measuring two-layer systems through thin film reflectometry (TFR). The model considers irregular interfaces and distortions introduced by the setup and the vertical vibration movements caused by the production process. The results show that the introduction of these latter variables is indispensable to obtain correct thickness values. The proposed approach is applied to a typical configuration of polymer electronics on transparent and non-transparent substrates. We compare our results to those obtained using a profilometer. The high degree of agreement between both measurements validates the model and suggests that the proposed measurement method can be used in industrial applications requiring fast and non-contact inspection of two-layer systems. Moreover, this approach can be used for other kinds of materials with known optical parameters.
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