Effects of the Deposition Mode and Heat Treatment on the Microstructure and Wettability of Y2O3 Coatings Prepared by Reactive Magnetron Sputtering
Effects of the Deposition Mode and Heat Treatment on the Microstructure and Wettability of Y2O3 Coatings Prepared by Reactive Magnetron Sputtering
复制标题
沉积方式和热处理对反应磁控溅射Y2O3涂层微观结构和润湿性的影响
DOI：
10.3390/coatings12060790
复制
发表时间：
2022-06
期刊：
影响因子：
3.4
通讯作者：
Lin Feng
中科院分区：
文献类型：
--
作者：
Xiaorui Ma;Zeyi Huang;Lin Feng
在高温下坚固的疏水Y2O3涂层对于工业应用是重要的。采用直流磁控溅射法在Si衬底上制备了Y2O3薄膜。通过改变沉积功率，分别在毒物模式和金属模式下获得了不同结构的Y2O3薄膜。为了了解热处理对Y2O3的微观结构和疏水性的影响，样品在空气中在400 °C下退火。与金属模式相比，中毒模式制备的Y2O3薄膜表面没有裂纹形成。另外，中毒模式沉积的Y2O3薄膜在400 °C退火前后表面的水接触角均在90°以上。它已被证明，在中毒模式下制备的Y2O3薄膜中的初始高浓度的物理吸附的氧和其缓慢的解吸过程有助于在高温下的薄膜的疏水性。这些结果可以为大规模制备用于高温应用的疏水Y2O3涂层提供见解。
A robust hydrophobic Y2O3 coating at high temperatures is important for industrial applications. In this study, Y2O3 thin films on Si substrates were prepared by reactive direct current magnetron sputtering. By changing the deposition power, Y2O3 thin films with different microstructures were obtained in poison mode and metallic mode, respectively. In order to understand the effect of heat treatment on the microstructure and hydrophobicity of Y2O3, the samples were annealed at 400 °C in the air. Compared to metallic mode, no crack was formed on the surface of the Y2O3 film prepared in poison mode. In addition, the water contact angle on the surface of the Y2O3 thin film deposited in poison mode was above 90° before and after annealing at 400 °C. It has been demonstrated that the initial high concentration of physically absorbed oxygen and its slow desorption process in a Y2O3 thin film prepared in poison mode contributes to the hydrophobicity of the thin film at high temperatures. These results can provide insights into the large-scale fabrication of hydrophobic Y2O3 coatings for high-temperature applications.
登录
查看更多内容
影响因子：
2.8
作者：
Dawid Gąszowski;M. Ilczyszyn
通讯作者：
Dawid Gąszowski;M. Ilczyszyn
影响因子：
2.6
作者：
Y. Mao;J. Engels;A. Houben;M. Rasinski;J. Steffens;A. Terra;C. Linsmeier;J. Coenen
通讯作者：
Y. Mao;J. Engels;A. Houben;M. Rasinski;J. Steffens;A. Terra;C. Linsmeier;J. Coenen
影响因子：
6.2
作者：
H. J. Quah;K. Cheong
通讯作者：
H. J. Quah;K. Cheong
影响因子：
3.2
作者：
S. Mahieu;W. Leroy;K. V. Aeken;D. Depla
通讯作者：
S. Mahieu;W. Leroy;K. V. Aeken;D. Depla
影响因子：
3.9
作者：
E. G. Lizarraga-Medina;D. L. C. –. Espitia;J. Gonzalez;J. López;H. Marquez;O. López;H. Tiznado
通讯作者：
E. G. Lizarraga-Medina;D. L. C. –. Espitia;J. Gonzalez;J. López;H. Marquez;O. López;H. Tiznado