Wettability in reactive Sn-base alloy/Ni-base metallic glass systems
Wettability in reactive Sn-base alloy/Ni-base metallic glass systems
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反应性锡基合金/镍基金属玻璃体系的润湿性
DOI：
10.1016/j.apsusc.2013.03.110
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发表时间：
2013-07
影响因子：
6.7
通讯作者：
Qi-Chuan Jiang
中科院分区：
文献类型：
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作者：
Lin-Yang Zhang;Ping Shen;Yan Qi;Qi-Chuan Jiang
标称成分为Ni-7Cr-3.2B-4.5Si-3Fe（wt. %）的镍基金属玻璃合金的无熔剂润湿在523K高真空条件下，采用点胶座滴法研究了几种Sn基钎料的界面结合行为，并对它们的界面微观结构进行了表征。结果表明，Sn-51wt. % In> Sn-37重量% Pb> Sn-57wt. % Bi> Sn-0.7wt. % Cu> Sn-3.0wt. % Ag-0.5wt. % Cu>纯Sn。界面由两个不同的层组成，上层为反应层，下层为Sn扩散层。对于Sn-0.7wt. % Cu、Sn-3.0wt. % Ag-0.5wt. % Cu和Sn-51wt. %在焊料中，主要反应产物分别为（Cu，Ni）6Sn5、（Ni，Cu）3Sn4和Ni3（Sn，In）4，而对于其它焊料，它们为Ni3Sn4。中心区域的反应层厚度在Sn-51wt. %的数量级上变化In>纯Sn> Sn-3.0重量% Ag-0.5wt. % Cu ≤ Sn-0.7wt. % Cu> Sn-57wt. % Bi> Sn-37重量% Pb，这可能与Sn的浓度和扩散速率有关。此外，界面反应促进了邻近反应层的非晶Ni基衬底的晶化，而晶化反过来又促进了Sn向衬底的扩散。讨论了这些钎料与镍基非晶合金润湿性不同的机理，并推荐了适用于这种非晶材料连接的钎料
Fluxless wetting of a Ni-base metallic glass alloy with a nominal composition of Ni–7Cr–3.2B–4.5Si–3Fe (wt.%) by several Sn-base solders was investigated using a dispensed sessile drop method in a high vacuum at 523K, and their interfacial microstructures were characterized. The results show that the wettability was in the sequence of Sn–51wt.% In>Sn–37wt.% Pb>Sn–57wt.% Bi>Sn–0.7wt.% Cu>Sn–3.0wt.% Ag–0.5wt.% Cu>pure Sn. The interface consisted of two distinct layers with the upper being the reaction layer and the lower the Sn-diffusion layer. For the Sn–0.7wt.% Cu, Sn–3.0wt.% Ag–0.5wt.% Cu and Sn–51wt.% In solders, the primary reaction products were (Cu,Ni)6Sn5, (Ni,Cu)3Sn4and Ni3(Sn,In)4, respectively, while for the other solders, they were Ni3Sn4. The thickness of the reaction layer in the central area varied in the order of Sn–51wt.% In>pure Sn>Sn–3.0wt.% Ag–0.5wt.% Cu≈Sn–0.7wt.% Cu>Sn–57wt.% Bi>Sn–37wt.% Pb, which is likely related to the concentration and diffusion rate of Sn. Moreover, the interfacial reaction facilitated the crystallization of the amorphous Ni-base substrates adjacent to the reaction layer and the crystallization in turn promoted the diffusion of Sn toward the substrate. The mechanisms for the different wettability of these solders with the Ni-base amorphous alloy were discussed, and finally suitable solders were recommended for the joining of this amorphous material
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影响因子：
1.2
作者：
H. Nishikawa;Krit WongPiromsarn;H. Abe;T. Takemoto;M. Fukuhara;A. Inoue
通讯作者：
H. Nishikawa;Krit WongPiromsarn;H. Abe;T. Takemoto;M. Fukuhara;A. Inoue
影响因子：
4
作者：
M. Rosenblum;F. Spaepen;D. Turnbull
通讯作者：
M. Rosenblum;F. Spaepen;D. Turnbull
影响因子：
2.6
作者：
Y. Y. Lee-Y.;H. Tseng;Y. Hsiao;C. Y. Liu
通讯作者：
Y. Y. Lee-Y.;H. Tseng;Y. Hsiao;C. Y. Liu
影响因子：
6.2
作者：
Hee-Yong Lee;Nam Hoon Goo;W. Jeong;K. Lee
通讯作者：
Hee-Yong Lee;Nam Hoon Goo;W. Jeong;K. Lee
DOI：
10.1109/96.618218
发表时间：
1997-08
期刊：
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
影响因子：
--
作者：
Chun-Jen Chen;Kwang-Lung Lin
通讯作者：
Chun-Jen Chen;Kwang-Lung Lin