Plasma profiling time-of-flight mass spectrometry for fast elemental analysis of semiconductor structures with depth resolution in the nanometer range
Plasma profiling time-of-flight mass spectrometry for fast elemental analysis of semiconductor structures with depth resolution in the nanometer range
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等离子体分析飞行时间质谱法,用于半导体结构的快速元素分析,深度分辨率在纳米范围内
DOI:
10.1088/1361-6641/ab6ac0
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发表时间:
2020
影响因子:
1.9
通讯作者:
A. Bakin
中科院分区:
文献类型:
--
作者:
H. Spende;C. Margenfeld;T. Meyer;I. M. Clavero;H. BremersA. Hangleiter;M. Seibt;A. Waag;A. Bakin
Plasma profiling time of flight mass spectrometry (PP-TOFMS) has recently gained interest as it enables the elemental profiling of semiconductor structures with high depth resolution in short acquisition times. As recently shown by Tempez et al PP-TOFMS can be used to obtain the composition within structures of modern field effect transistors [1]. There, the results were compared to conventional SIMS measurements. In the present study, we compare PP-TOFMS measurements of an Al-/In-/GaN quantum well multi stack to established micro-and nanoanalysis techniques like cathodoluminescence (CL), scanning transmission electron microscopy (STEM), energy dispersive x-ray spectroscopy (EDX) and x-ray diffraction (XRD). We show that PP-TOFMS is able to resolve the layer structure of the sample even more than 500 nm deep into the sample and allows the determination of a relative elemental composition with an accuracy of about 10 rel%. Therefore, it is an extremely rapid alternative method to obtain semiconductor elemental depth profiles without the expensive and time consuming sample preparation required for TEM. Besides, PP-TOFMS offers better depth resolution and more elemental information than, for example, electrochemical capacitance–voltage (ECV) evaluations, since all elements are detected in parallel and not only electrically (ECV) or optically (CL) active elements are observed.
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影响因子:
3.7
作者:
Hahn, W.;Lentali, J. -M.;Peretti, J.
通讯作者:
Peretti, J.
影响因子:
2.1
作者:
D. Keogh;P. Asbeck;T. Chung;R. Dupuis;M. Feng
通讯作者:
M. Feng
DOI:
10.1116/1.5019635
发表时间:
2018
期刊:
Journal of Vacuum Science & Technology. B. Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena
影响因子:
--
作者:
Y. Mazel;E. Nolot;J. Barnes;M. Charles;R. Bouveyron;M. Mrad;A. Tempez;S. Legendre
通讯作者:
S. Legendre
DOI:
10.1116/1.4943513
发表时间:
2016
期刊:
Journal of Vacuum Science & Technology. B. Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena
影响因子:
--
作者:
A. Tempez;S. Legendre;J. Barnes;E. Nolot
通讯作者:
E. Nolot
影响因子:
1.5
作者:
J. Ou;Yung–Chung Pan;Wen;C. Shu;Heng–Ching Lin;M. Lee;Wen;C. Chiang;Horng Chang;Wei
通讯作者:
Wei