A 2 Gb/s Bi-Directional Inter-Chip Data Transceiver With Differential Inductors for High Density Inductive Channel Array

A 2 Gb/s Bi-Directional Inter-Chip Data Transceiver With Differential Inductors for High Density Inductive Channel Array
复制标题

具有用于高密度电感通道阵列的差分电感器的 2 Gb/s 双向芯片间数据收发器

DOI:
10.1109/jssc.2008.2004530
复制
发表时间:
2007
影响因子:
5.4
通讯作者:
T. Kuroda
T. Kuroda
中科院分区:
工程技术1区
文献类型:
--
作者:
Y. Yoshida;N. Miura;T. Kuroda

文献摘要

参考文献

被引文献

相似文献

首次在180 nm CMOS工艺上实现了2 Gb/s双向片间数据收发器。两个正交的差分电感对垂直重叠以形成双向通道。利用这些信道,无需任何复杂的电路技术就可建立双向通信系统。还考虑了通道阵列中的串扰干扰问题。差分电感由于其抗噪性,可以使通道阵列中的间距更短。与传统的电感阵列数据链相比,该技术实现了64%的面积减少相同的速度。
A 2 Gb/s bi-directional inter-chip data transceiver is experimentally demonstrated for the first time in 180 nm CMOS technology. Two orthogonal differential inductor pairs are vertically overlapped to make a bi-directional channel. Using these channels, bi-directional communication system is established without any complex circuit techniques. The crosstalk interference problem in channel array is also considered. Differential inductors, due to their noise immunity can make shorter pitches possible in channel array. Compared with the data link with conventional inductor array, this proposed technique achieves 64% area reduction with the same speed.
用于芯片间时钟和数据链路的 1Tb/s 3W 电感耦合收发器
DOI: --
发表时间: 2006
期刊: Technical report of IEICE Vol.106, No.71
影响因子: --
作者:
村山芳隆;小澤哲也;堀越直;薮上信;石山和志;荒井賢一;N.Miura
通讯作者: N.Miura
DOI: 10.1109/isscc.2004.1332634
发表时间: 2004-09
期刊: 2004 IEEE International Solid-State Circuits Conference (IEEE Cat. No.04CH37519)
影响因子: --
作者:
D. Mizoguchi;Y.B. Yusof;N. Miura;T. Sakura;T. Kuroda
通讯作者: D. Mizoguchi;Y.B. Yusof;N. Miura;T. Sakura;T. Kuroda
具有发射功率控制方案的 195Gb/s 1.2W 3D 堆叠感应片间无线超级连接
DOI: --
发表时间: 2005
期刊: Technical report of IEICE Vol.105, No.96
影响因子: --
作者:
小澤哲也;横田周子;堀越直;藪上信;石山和志;荒井賢一;N.Miura
通讯作者: N.Miura
DOI: 10.1109/jssc.2005.845560
发表时间: 2005-04
影响因子: 5.4
作者:
N. Miura;D. Mizoguchi;T. Sakurai;T. Kuroda
通讯作者: N. Miura;D. Mizoguchi;T. Sakurai;T. Kuroda