An integrated planar magnetic micropump.
An integrated planar magnetic micropump.
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一个集成的平面磁微孔。
DOI:
10.1016/j.mee.2013.11.014
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发表时间:
2014-04-01
影响因子:
2.3
通讯作者:
Lin Q
中科院分区:
文献类型:
--
作者:
Ni J;Wang B;Chang S;Lin Q
This paper presents an integrated magnetic micropump that uses in-plane compliance-based check valves and a magnetically actuated membrane. The device, which allows for simple fabrication and system integration with other functional elements, consists of two functional layers both fabricated from poly(dimethylsiloxane) (PDMS). The upper PDMS layer provides a compliant membrane with an electroplated thin-film permalloy strip for actuation, while the lower PDMS layer incorporates microfluidic components including the microchannels, pump chamber, and a pair of check valves for flow regulation. The PDMS check valves, each having a compliant flap in contact with a stiff stopper to allow for unidirectional fluid flow with minimized leakage, are located at the inlet and outlet of the pump chamber, respectively. As such, the unidirectional flow at a controlled volumetric rate can be readily generated in accordance with the pumping actions. Systematic characterization of the micropump has been performed by studying the dependence of its pumping flow rate on the driving frequency of magnetic actuation, and the back pressure. Experimental results show that this micropump is capable of generating fluid flow of 0.15 μL/min at the frequency of 2 Hz, corresponding to a volume resolution of 1 nL per stroke, and working reliably against a maximum back-pressure of 550 Pa, demonstrating the potential application of this micropump for various integrated lab-on-a-chip systems.
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DOI:
10.1109/jmems.2011.2174423
发表时间:
2012-02
期刊:
Journal of microelectromechanical systems : a joint IEEE and ASME publication on microstructures, microactuators, microsensors, and microsystems
影响因子:
--
作者:
Wang B;Ni J;Litvin Y;Pfaff DW;Lin Q
通讯作者:
Lin Q
DOI:
10.1088/0960-1317/20/9/095033
发表时间:
2010
期刊:
Journal of micromechanics and microengineering : structures, devices, and systems
影响因子:
--
作者:
Ni J;Huang F;Wang B;Li B;Lin Q
通讯作者:
Lin Q
影响因子:
2.7
作者:
Jo, BH;Van Lerberghe, LM;Beebe, DJ
通讯作者:
Beebe, DJ
影响因子:
6.1
作者:
Xie, J;Shih, J;Tai, YC
通讯作者:
Tai, YC
影响因子:
6.1
作者:
Kim, JeongYun;Baek, JuYeoul;Lee, SangHoon
通讯作者:
Lee, SangHoon