A planar PDMS micropump using in-contact minimized-leakage check valves.
A planar PDMS micropump using in-contact minimized-leakage check valves.
复制标题
DOI：
10.1088/0960-1317/20/9/095033
复制
发表时间：
2010
期刊：
影响因子：
--
通讯作者：
Lin Q
中科院分区：
文献类型：
--
作者：
Ni J;Huang F;Wang B;Li B;Lin Q
我们提出了一种微泵，具有简单的平面设计，在单层中具有兼容的接触式止回阀，这使得结构简单，易于系统集成。该微泵基于聚二甲基硅氧烷（PDMS），主要由气动薄膜、泵腔和两个平面内止回阀组成。这对止回阀基于接触式挡板结构，能够最大限度地减少泄漏流量，极大地提高了微泵的可靠性和性能。根据泵流量的频率响应，对微泵进行了系统的实验表征，这些频率响应与设备几何形状（例如腔室高度）和操作参数（例如气动驱动压力和背压）等因素有关。结果表明，该微泵能够可靠地产生41 μL min - 1的最大流量，并在高达25 kPa的高背压下运行。此外，还建立了平面微泵的集总参数理论模型，以准确分析器件的性能。这些结果证明了这种微泵在芯片实验室系统中的各种应用能力。
We present a micropump with a simple planar design featuring compliant in-contact check valves in a single layer, which allows for a simple structure and easy system integration. The micropump, based on poly(dimethylsiloxane) (PDMS), primarily consists of a pneumatically driven thin membrane, a pump chamber, and two in-plane check valves. The pair of check valves is based on an in-contact flap–stopper configuration and is able to minimize leakage flow, greatly enhancing the reliability and performance of the micropump. Systematic experimental characterization of the micropump has been performed in terms of the frequency response of the pumping flow rate with respect to factors including device geometry (e.g. chamber height) and operating parameters (e.g. pneumatic driving pressure and backpressure). The results demonstrate that this micropump is capable of reliably generating a maximum flow rate of 41 μL min−1 and operating against a high backpressure of up to 25 kPa. In addition, a lumped-parameter theoretical model for the planar micropump is also developed for accurate analysis of the device behavior. These results demonstrate the capability of this micropump for diverse applications in lab-on-a-chip systems.
登录
查看更多内容
影响因子：
2.7
作者：
Jo, BH;Van Lerberghe, LM;Beebe, DJ
通讯作者：
Beebe, DJ
影响因子：
6.1
作者：
Xie, J;Shih, J;Tai, YC
通讯作者：
Tai, YC
影响因子：
6.1
作者：
Kim, JeongYun;Baek, JuYeoul;Lee, SangHoon
通讯作者：
Lee, SangHoon
影响因子：
4.6
作者：
Yoo, Jong-Chul;Choi, Y. J.;Kim, Yong-Sang
通讯作者：
Kim, Yong-Sang
影响因子：
4.6
作者：
Yin, Hung-Lin;Huang, Yu-Che;Hsieh, Jerwei
通讯作者：
Hsieh, Jerwei