Solder Size Effect on Early Stage Interfacial Intermetallic Compound Evolution in Wetting Reaction of Sn3.0Ag0.5Cu/ENEPIG Joints
Solder Size Effect on Early Stage Interfacial Intermetallic Compound Evolution in Wetting Reaction of Sn3.0Ag0.5Cu/ENEPIG Joints
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焊料尺寸对 Sn3.0Ag0.5Cu/ENEPIG 接头润湿反应中早期界面金属间化合物演化的影响
DOI：
10.1016/j.jmst.2015.01.003
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发表时间：
2015-03
期刊：
影响因子：
--
通讯作者：
F. Yang
中科院分区：
文献类型：
--
作者：
M.L. Huang;F. Yang
研究了Sn-3.0Ag-0.5Cu钎料球与化学镀镍-化学镀钯-浸金（ENEPIG）焊盘在250 °C下润湿反应早期界面金属间化合物（IMC）演变的钎料尺寸效应。在界面反应初期，界面金属间化合物由针状和棒状（Cu，Ni）6Sn 5转变为十二面体（Cu，Ni）6Sn 5，再转变为针状（Ni，Cu）3Sn 4。此外，这些IMC转变在较小的焊点中发生得更早，由于界面（Cu，Ni）6Sn 5的形成消耗了Cu，因此Cu浓度的下降速率更快。热力学上，钎料中Cu浓度的降低改变了界面相平衡，导致界面IMC的形成;动力学上，较大尺寸焊点有足够的Cu向界面流动，使（Cu，Ni）6Sn 5晶粒长大，从而导致IMC转变延迟，并形成较大的十二面体型（Cu，Ni）6Sn 5晶粒。在较小的焊料，没有剥落，但（Cu，Ni）6Sn 5晶粒的形成（Ni，Cu）3Sn 4晶粒的消耗发生在较小的离散（Cu，Ni）6Sn 5晶粒形成在界面处。
Solder size effect on early stage interfacial intermetallic compound (IMC) evolution in wetting reaction between Sn–3.0Ag–0.5Cu solder balls and electroless nickel electroless palladium immersion gold (ENEPIG) pads at 250 °C was investigated. The interfacial IMCs transformed from initial needle- and rod-type (Cu,Ni)6Sn5to dodecahedron-type (Cu,Ni)6Sn5and then to needle-type (Ni,Cu)3Sn4at the early interfacial reaction stage. Moreover, these IMC transformations occurred earlier in the smaller solder joints, where the decreasing rate of Cu concentration was faster due to the Cu consumption by the formation of interfacial (Cu,Ni)6Sn5. On thermodynamics, the decrease of Cu concentration in liquid solder changed the phase equilibrium at the interface and thus resulted in the evolution of interfacial IMCs; on kinetics, larger solder joints had sufficient Cu flux toward the interface to feed the (Cu,Ni)6Sn5growth in contrast to smaller solder joints, thus resulted in the delayed IMC transformation and the formation of larger dodecahedron-type (Cu,Ni)6Sn5grains. In smaller solders, no spalling but the consumption of (Cu,Ni)6Sn5grains by the formation of (Ni,Cu)3Sn4grains occurred where smaller discrete (Cu,Ni)6Sn5grains formed at the interface.
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影响因子：
6.2
作者：
Yoon, Jeong-Won;Noh, Bo-In;Jung, Seung-Boo
通讯作者：
Jung, Seung-Boo
影响因子：
2.1
作者：
B. Chung;Y. Baek;Jaeho Choi;J. Huh
通讯作者：
B. Chung;Y. Baek;Jaeho Choi;J. Huh
影响因子：
6.2
作者：
Jeong-Won Yoon;Sang-Won Kim;Seung-Boo Jung
通讯作者：
Jeong-Won Yoon;Sang-Won Kim;Seung-Boo Jung
影响因子：
4
作者：
Huang, ML;Loeher, T;Reichl, H
通讯作者：
Reichl, H
DOI：
10.1016/j.microrel.2007.05.002
发表时间：
2008-04
期刊：
Microelectron. Reliab.
影响因子：
--
作者：
C. K. Wong;J. Pang;J. Tew;B. Lok;Haijing Lu;F. L. Ng;Yaofeng Sun
通讯作者：
C. K. Wong;J. Pang;J. Tew;B. Lok;Haijing Lu;F. L. Ng;Yaofeng Sun