Biocompatibility and bond degradation of poly-acrylic acid coated copper iodide-adhesives.
Biocompatibility and bond degradation of poly-acrylic acid coated copper iodide-adhesives.
复制标题
DOI：
10.1016/j.dental.2017.06.010
复制
发表时间：
2017-09
期刊：
影响因子：
--
通讯作者：
Sabatini C
中科院分区：
文献类型：
--
作者：
ALGhanem A;Fernandes G;Visser M;Dziak R;Renné WG;Sabatini C
探讨聚丙烯酸（PAA）碘化铜（CuI）胶粘剂对粘结降解、拉伸强度和生物相容性的影响。将PAA-CuI颗粒掺入Optibond XTR、Optibond Solo和XP bond中，掺入浓度分别为0.1和0.5 mg/ml。Clearfil SE Protect是一种含mdpb的胶粘剂，作为对照。将胶粘剂应用于人牙本质，以2mm的增量进行聚合和复合修复。24小时、6个月和1年后树脂-抗拉结合强度。沙漏试样（10 × 2 × 1 mm）的极限抗拉强度（UTS）进行评估。采用MTT法观察8 × 1 mm黏附盘对人牙龈成纤维细胞代谢功能的影响。用紫外-可见分光光度计测定5 × 1 mm粘片在0.9% NaCl中浸泡1、3、5、7、10、14、21和30 d后的铜释放量。采用SEM、EDX和XRF对其进行微观结构表征。无论浓度如何，用PAA-CuI修饰XTR和Solo均不发生降解。相对于对照组，含有PAA-CuI的粘合剂的UTS保持不变。Solo 0.5 mg/ml和XP 0.1或0.5 mg/mlPAA-CuI使活细胞百分比降低。XP表现出最高的离子释放。所有组在第1天和第14天释放量最高。PAA-CuI颗粒在1年后阻止了XTR和Solo的粘合降解，而不影响任何粘合剂的UTS。部分黏合剂对细胞活力有影响。所有黏合剂都有相似的铜释放模式。
To investigate the effect of poly-acrylic acid (PAA) copper iodide (CuI) adhesives onbond degradation, tensile strength, and biocompatibility. PAA-CuI particles were incorporated into Optibond XTR, Optibond Solo and XP Bondin 0.1 and 0.5 mg/ml. Clearfil SE Protect, an MDPB-containing adhesive, was used as control.The adhesives were applied to human dentin, polymerized and restored with compositein 2 mm-increments. Resin–tensilebond strength after 24 h, 6 months and 1 year. Hourglass specimens (10 × 2 × 1 mm) wereevaluated for ultimate tensile strength (UTS). Cell metabolic function of human gingivalfibroblast cells exposed to adhesive discs (8 × 1 mm) was assessed with MTT assay. Copperrelease from adhesive discs (5 × 1 mm) was evaluated with UV–vis spectrophotometer afterimmersion in 0.9% NaCl for 1, 3, 5, 7, 10, 14, 21 and 30 days. SEM, EDX and XRF were conductedfor microstructure characterization. XTR and Solo did not show degradation when modified with PAA-CuI regardless ofthe concentration. The UTS for adhesives containing PAA-CuI remained unaltered relative tothe controls. The percent viable cells were reduced for Solo 0.5 mg/ml and XP 0.1 or 0.5 mg/mlPAA-CuI. XP demonstrated the highest ion release. For all groups, the highest release wasobserved at days 1 and 14. PAA-CuI particles prevented the bond degradation of XTR and Solo after 1 yearwithout an effect on the UTS for any adhesive. Cell viability was affected for some adhesives.A similar pattern of copper release was demonstrated for all adhesives.
登录
查看更多内容
影响因子：
5
作者：
Carrilho, Marcela R.;Carvalho, Ricardo M.;Sousa, Ethan N.;Nicolau, Jose;Breschi, Lorenzo;Mazzoni, Annalisa;Tjaderhane, Leo;Tay, Franklin R.;Agee, Kelli;Pashley, David H.
通讯作者：
Pashley, David H.
影响因子：
5
作者：
McGinley, Emma Louise;Coleman, David C.;Fleming, Garry J. P.
通讯作者：
Fleming, Garry J. P.
影响因子：
4.4
作者：
Pal, Sukdeb;Tak, Yu Kyung;Song, Joon Myong
通讯作者：
Song, Joon Myong
影响因子：
4.4
作者：
IMAZATO, S;RUSSELL, RRB;MCCABE, JF
通讯作者：
MCCABE, JF
影响因子：
5
作者：
Carrilho, MRD;Tay, FR;Carvalho, RM
通讯作者：
Carvalho, RM