High-mobility hydrogenated polycrystalline In(2)O(3) (In(2)O(3):H) thin-film transistors.

High-mobility hydrogenated polycrystalline In(2)O(3) (In(2)O(3):H) thin-film transistors.
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DOI:
10.1038/s41467-022-28480-9
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发表时间:
2022-02-28
影响因子:
16.6
通讯作者:
Furuta M
Furuta M
中科院分区:
综合性期刊1区
文献类型:
--
作者:
Magari Y;Kataoka T;Yeh W;Furuta M

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氧化物半导体已被广泛研究作为用于电子应用的薄膜晶体管(TFT)的有源沟道层。然而,氧化物TFT的场效应迁移率(μFE)不足以与低温处理的多晶硅TFT(50-100 cm 2 V-1 s-1)竞争。在这里,我们提出了一个简单的过程来获得高性能的TFT,即氢化多晶In 2 O3(In 2 O3:H)TFT生长通过低温固相结晶(SPC)过程。在300 °C条件下制造的In 2 O3:H TFT具有优异的上级开关特性,µFE = 139.2 cm 2 V − 1 s −1,亚阈值摆幅为0.19 Vdec−1,阈值电压为0.2 V。溅射沉积过程中引入的氢对增大SPC法制备的In 2 O3:H的晶粒尺寸和减少亚带隙缺陷起着重要作用。所提出的方法不需要任何额外的昂贵设备和/或改变传统的氧化物TFT制造工艺。我们相信这些SPC生长的In 2 O3:H TFT在未来的透明或柔性电子应用中具有巨大的潜力。氧化物半导体薄膜晶体管的场效应迁移率与硅薄膜晶体管相比不够高。Magari等人使用低温固相结晶工艺来制造迁移率与硅晶体管相当的In 2 O3薄膜晶体管。
Oxide semiconductors have been extensively studied as active channel layers of thin-film transistors (TFTs) for electronic applications. However, the field-effect mobility (μFE) of oxide TFTs is not sufficiently high to compete with that of low-temperature-processed polycrystalline-Si TFTs (50–100 cm2V−1s−1). Here, we propose a simple process to obtain high-performance TFTs, namely hydrogenated polycrystalline In2O3 (In2O3:H) TFTs grown via the low-temperature solid-phase crystallization (SPC) process. In2O3:H TFTs fabricated at 300 °C exhibit superior switching properties with µFE = 139.2 cm2V−1s−1, a subthreshold swing of 0.19 Vdec−1, and a threshold voltage of 0.2 V. The hydrogen introduced during sputter deposition plays an important role in enlarging the grain size and decreasing the subgap defects in SPC-prepared In2O3:H. The proposed method does not require any additional expensive equipment and/or change in the conventional oxide TFT fabrication process. We believe these SPC-grown In2O3:H TFTs have a great potential for use in future transparent or flexible electronics applications. The field-effect mobility of oxide semiconductor thin-film transistors is not sufficiently high compared to silicon thin-film transistors. Magari et al. use a low-temperature solid-phase crystallization process to fabricate In2O3 thin-film transistors with mobility comparable to silicon counterparts.
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